uneven color

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3

3. Various processes can lead to pit formation during electroplating, including copper immersion, pattern transfer, and inadequate cleaning during pre-treatment and plating. 4. Issues with air agitation, cotton cores, and cleaning after degreasing can result in whitish or uneven color on the board surface during electroplating. Concluding Remarks: Troubleshooting and innovation are essential for improving craftsmanship and achieving high-quality coatings in the acid copper plating process.

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3 Read More »

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3

3. Various processes can lead to pit formation during electroplating, including copper immersion, pattern transfer, and inadequate cleaning during pre-treatment and plating. 4. Issues with air agitation, cotton cores, and cleaning after degreasing can result in whitish or uneven color on the board surface during electroplating. Concluding Remarks: Troubleshooting and innovation are essential for improving craftsmanship and achieving high-quality coatings in the acid copper plating process.

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3 Read More »

Causes and Remediation of Defects in Electroplating Nickel Processes

The causes and elimination of faults in PCB electroplating nickel process include organic pollution leading to makeng and pinholes, roughness and burrs due to impurities, low adhesion from poor deoxidation, coating brittleness and poor weldability from organic and heavy metal pollution, uneven color and dark coating from metal pollution, coating burn from various factors, low deposition rate from low pH or current density, blistering or peeling from various factors, and anode passivation from insufficient anode activator and other factors.

Causes and Remediation of Defects in Electroplating Nickel Processes Read More »

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