Analysis of Voiding Issues in SMT Assembly
Voids in the PCB assembly process can have various causes and effects, including shrinkage voids, microvia voids, and MC microvoids, which may impact reliability and screenability in different ways.
Voids
Causes of concurrent solder voiding and short circuiting in FR4 PCBs with BGAs
During BGA soldering, FR4 PCB manufacturers may experience issues such as voids, short circuits, and deformation due to temperature differences, which can be mitigated through proper heating slopes, preheating, and design improvements.
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Quality Issues with Lead-Free Soldering in FR4 PCBs
The causes of voids in solder joints on FR4 PCBs include unequal volume ratios of solder alloy and organic materials, formation of voids in BGA pad solder joints, surface treatment films, oxidation of tin powder and flux, solder pad rejection, and absorption of water by the solder paste.
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