The impact of poor FPC design on SMT production is profound, directly affecting assembly quality and efficiency, leading to delays and dissatisfaction in customer deliveries.
The FPC design process exhibits imperfections and inherent limitations. Read More »
Revised: In PCB processing, various welding defects may occur, including black boundary lines between solder and leads, loose solder structures, excessive or insufficient solder, rosin slag, overheating, cold welding, poor infiltration, each posing risks to functionality due to factors like inadequate cleaning or flux quality.
Welding defects in electronic processing, such as virtual and cold welding, can lead to poor SMT patch welding. To deal with these problems, adjust the reflow temperature curve, replace solder paste, check equipment functionality, and ensure good soldering performance and printing results.
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