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Can a module be designed to have both castellations and LGA connectors?

The individual is seeking advice on choosing a pinout method for a module assembled board-to-board on a larger PCB, considering the combination of LGA and castellations, and questioning the mechanical feasibility and potential conflicts during the assembly process. They are open to opinions and suggestions.

Can a module be designed to have both castellations and LGA connectors? Read More »

Components are through-hole mounted on one side and surface mounted on the other.

The individual is inquiring about the potential drawbacks of having through-hole connectors on one side of the board and everything else, such as surface-mounted components, on the other. They are questioning whether this assembly makes selective or wave soldering more challenging and considering consolidating all components on the same side if feasible.

Components are through-hole mounted on one side and surface mounted on the other. Read More »

Pads with silkscreen printing

The individual is puzzled by the discovery of solder-masked and silkscreened pins on a TQFP package, and is seeking explanations for the purpose behind this rather than leaving the pins unsoldered. They also question the decision to silkscreen the pads instead of using solder mask. They speculate potential reasons for these design choices and seek insights from the community.

Pads with silkscreen printing Read More »

Is it possible to apply silkscreen directly onto the copper PCB layer without using solder mask?

The individual is inquiring about the feasibility of directly printing a PCB silkscreen layer onto a copper layer without using a solder mask, as this possibility would be beneficial for their specific design. They are seeking input from anyone with experience in doing so.

Is it possible to apply silkscreen directly onto the copper PCB layer without using solder mask? Read More »

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