In PCB production, the shift from lead-based to lead-free soldering processes is driven by environmental regulations, performance differences, and cost considerations, with lead-free technology offering better solderability and aligning with global sustainability efforts despite higher costs.
What are the consequences of lead presence on a PCB circuit board? Read More »
Signal integrity issues, including waveform distortion, crosstalk, and track collapse, are becoming more prevalent in modern high-speed PCB designs due to faster IC switching speeds, lower core voltages, and increased noise sensitivity, with impedance matching playing a critical role in addressing these challenges.
Research on Signal Integrity in PCB (Printed Circuit Board) Read More »
The positioning of printed circuit boards (PCBs) is based on two methods: **rough positioning**, which focuses on ease of assembly with lower accuracy, and **precise positioning**, which prioritizes accuracy, ensuring correct installation and preventing reverse mounting.
Why is positioning and foolproof design necessary for PCB boards? Read More »
Signal integrity in high-speed digital PCBs is crucial for ensuring accurate signal timing and voltage levels, as factors like component placement, routing, and termination can lead to issues such as delay, reflection, crosstalk, and ground bounce, potentially causing system malfunctions or failure.
Signal Integrity in High-Speed Digital PCB Design Read More »
Farpatch is a wireless debugger that has the ability to program debug and interact with a variety of microcontrollers Powered by BlackMagic debug software Farpatch supports inspecting memory singl
High-Speed PCB DesignThe importance of PCB design for high-speed circuit boards is becoming more apparent as the demand for electronic devices that are faster and more complicated increases High-spe
Best Practices for High-Speed PCB Design – Engineering Expertise – Wellcircuits Read More »
This tutorial takes a 1mm through-hole and a 16mm pad as an exampleStep 1 Find Padstack Editor and then clickStep 2 Select Thru Pin on Start interfaceStep 3 Switch to Drill interface and fill o
PCB copper issues, such as poor adhesion and copper lifting, arise from process defects, substrate compatibility problems, and design flaws, while substrates are classified based on materials, flame retardancy, and resin types.
Factors Contributing to PCB Copper Rejection and Classification of PCB Substrates Read More »
The PCB industry is increasingly adopting industrial robots to address labor shortages, reduce costs, and improve efficiency, with gradual automation from single-station setups to fully integrated systems, though challenges like non-standard products and workspace limitations remain.
What are the future trends in PCB circuit board manufacturing? Read More »
The assembly layer in PCB design defines the physical size and placement of components for automated assembly, while the silk screen layer provides reference marks and component outlines for manual assembly.
Have you overlooked the common terminology used in PCB design? Read More »
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