To divide an inner electric layer of a multilayer PCB, define the layer, use the “Split Planes” command to set segmentation, adjust track width for insulation, select networks, and draw boundaries while avoiding overlap with pads to ensure proper connectivity and minimize impedance.
Technique for Segregating Electrical Layers within a PCB Read More »
In PCB design, establishing an accurate board-level signal integrity model is crucial for design correctness, with SPICE, IBIS, and Verilog-A being the main models used, each varying in accuracy, complexity, and computational effort.
High-speed digital PCB signal integrity analysis model Read More »
Defects in soldering, such as bubbles, lack of solder, overheating, cold welding, copper foil lifting, pinhole formation, and rosin soldering, arise from various issues including thermal imbalance, insufficient solder, excessive heat, and improper techniques, each impacting joint strength and circuit reliability.
PCB soldering defects resulting from environmental factors. Read More »
Once PCB design is complete, a comprehensive inspection is crucial, including DFM review, component alignment verification, 3D modeling, production line optimization, and other detailed checks to ensure the design meets all functional and manufacturing requirements.
PCB design for manufacturability and fabrication processes. Read More »
PCB design’s impact on circuit performance and cost, China’s booming PCB industry due to foreign investment, the talent shortage in lower-tier cities, uneven application distribution, and the lag in design technology compared to global standards.
PCB design’s impact on circuit performance and cost Read More »
Innovative PCB reverse engineering drives advancements in smart terminal technologies, enhancing performance and user experience through continual technological integration and iterative improvements.
Where does PCB technology stand in the age of smart terminals? Read More »
Effective PCB product testing through ICT improves quality and profitability by detecting defects early in the electronics manufacturing process.
Comprehend the concept of In-Circuit Testing (ICT) for PCBA circuit boards. Read More »
**SMT processing challenges include issues like abnormal materials, poor soldering, and solder paste failures, which require careful handling of components and soldering techniques to avoid problems like insufficient solder and ineffective flux activity.**
The color of a PCB does not affect its performance, which is determined by material quality, design, and layering; black PCBs are more challenging to work with but are often used for high-end products, while red, green, or blue PCBs are more common in high-volume production.
How to differentiate between high-quality and substandard colors during PCB proofing? Read More »
Hand soldering involves mastering essential techniques, with human skill being the most critical element, as proper soldering requires practice, understanding, and correct application of materials, tools, methods, and operator expertise.
SMT process: Manual soldering iron and welding techniques. Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.