Reliability testing of PCBA lead-free solder joints involves various methods like visual inspection, X-ray analysis, mechanical stress tests, and environmental simulations to assess their durability and performance under thermal, mechanical, and environmental stresses, ensuring long-term reliability for electronic products.
Reliability Testing of Lead-Free Solder Joints in PCBA Read More »
In PCB manufacturing, Design Rule Check (DRC) ensures the design meets electrical and layout standards, while Design for Manufacturability (DFM) evaluates the design’s feasibility for production; both are essential steps, with DRC addressing design integrity and DFM focusing on manufacturing compatibility, complemented by X-ray inspection to verify the quality of hidden BGA solder joints in the assembly.
The five main PCB testing methods—manual visual inspection, automated optical inspection (AOI), functional testing, in-circuit testing (ICT), and X-ray inspection—each offer distinct advantages and limitations for ensuring the quality, reliability, and performance of circuit boards in electronic manufacturing.
The five main PCB testing methods—manual visual inspection, automated optical inspection (AOI), functional testing, in-circuit testing (ICT), and X-ray inspection—each offer distinct advantages and limitations for ensuring the quality, reliability, and performance of circuit boards in electronic manufacturing.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.