1.1 Production Board
Any PCB board that meets the design drawings, relevant specifications, and procurement requirements and is produced in one production batch.
1.2 As Received
The product submitted for acceptance has not been subjected to any conditioning treatment, and it is in the state of mechanical testing under normal atmospheric conditions.
1.3 Test Board
A printed board is produced by the same process and used to determine the acceptability of a batch of printed boards. It represents the quality of the batch of printed boards.
1.4 Test Pattern
A conductive pattern is used to complete a test. The pattern can be a part of the conductive pattern on the production board or a specially designed special test pattern. This test pattern can be placed on the attached test board. The liquid can be placed on a separate test board.
1.5 Composite Test Pattern
A combination of two or more different test patterns, usually placed on a test board.
1.6 Quality Conformance Test Circuit
A complete set of test patterns is included in the build to determine the acceptability of the printed board quality on the build.
1.7 Test Coupon Attached Test Board
A drawing of a portion of a quality conformance test circuit used for a specified acceptance test or set of related tests.
1.8 Storage Life
2. Appearance and size
2.1 Visual examination
Physical features are examined with the naked eye or at specified magnifications.
2.2 Blister
Local separation caused by expansion between substrate layers, substrate and conductive foil, or substrate and protective coating, resulting in delamination.
2.3 Blow hole
Holes caused by exhaust.
2.4 Bulge
Bumps on the printed board or foil due to internal delamination or separation of fibers from resin.
2.5 Circumferential separation
Crack or void in plating around plated-through holes, solder joints, or at joint interfaces.
2.6 Cracking
Breakage in a metallic or non-metallic layer that may extend to the bottom.
2.7 Crazing
Separation of glass fibers from resin in a substrate, manifested as white spots or crosses under the surface.
2.8 Measling
Separation of glass fiber and resin inside the substrate, manifested as scattered white spots or cross patterns under the surface.
2.9 Crazing of conformal coating
Microscopic cracks on the surface and inside conformal coating.
2.10 Delamination
Separation between insulating substrates, insulating substrates and conductive foils, or within a multilayer board.
2.11 Dent
Smooth depressions on the surface of the conductive foil.
2.12 Extraneous copper
Unwanted copper remaining on the substrate after chemical treatment.
2.13 Fiber exposure
Reinforcing fibers exposed due to mechanical processing, abrasion, or chemical attack.
2.14 Weave exposure
Unbroken woven glass fibers not completely covered by resin on the substrate surface.
2.15 Weave texture
Woven glass cloth fibers completely covered by resin, with the weave pattern visible on the surface.
2.16 Wrinkle
Creases or wrinkles on the foil surface.
2.17 Haloing
Destruction or delamination on or under the substrate surface due to machining, manifested as whitish areas around holes.
2.18 Hole breakout
Connection plate not completely surrounding the hole.
2.19 Flare
Tapered hole formed in the substrate during punching.
2.20 Splay
Eccentric, out-of-round, or non-perpendicular holes produced by rotary drilling.
2.21 Void
Lack of substances in a local area.
2.22 Hole void
Hole exposing the substrate within the plated-through hole metallization.
2.23 Inclusion
Foreign particles trapped in substrates, wire layers, plating coatings, or solder joints.
2.24 Lifted land
Land lifted or separated from the substrate, regardless of resin being lifted.
2.25 Nail heading
Copper foil on the inner conductor stretched along the hole wall due to drilling in a multilayer board.
2.26 Nick
2.27 Node
Irregular lumps or nodules protruding from the coating surface.
2.28 Pinhole
Hole completely penetrating a layer of metal.
2.29 Resin recession
Cavity between plated-through hole wall and drilled hole wall, visible in microsection after high-temperature exposure.
2.30 Scratch
2.31 Bump
Protrusions on the conductive foil surface.
2.32 Conductor thickness
2.33 Minimum annular ring
2.34 Registration
Consistency of graphic, hole, or other feature locations on the printed board with specified locations.
2.35 Base material thickness
2.36 Metal-clad laminate thickness
2.37 Resin starved area
Area of laminate with inadequate resin infiltration, showing poor gloss or exposed fibers.
2.38 Resin-rich area
Laminate surface area with significantly thickened resin and no reinforcement.
2.39 Gelation particle
Cured, typically translucent particles in laminate.
2.40 Treatment transfer
Copper foil treatment layer (oxide) transferring to the substrate surface, leaving traces after etching.
2.41 Printed board thickness
Total thickness of substrate and conductive material (including plating) overlying the substrate.
2.42 Total board thickness
Thickness of the printed board, including electroplating and other coating layers.
2.43 Rectangularity
Offset of rectangular plate corners from 90 degrees.
3. Electrical properties
3.1 Contact resistance
Surface resistance at the contact interface under specified conditions.
3.2 Surface resistance
Quotient of DC voltage between two electrodes on the same insulator surface divided by the steady-state current.
3.3 Surface resistivity
Quotient of DC electric field strength at insulator surface divided by current density.
3.4 Volume resistance
Quotient of DC voltage between electrodes on opposite surfaces divided by steady-state current.
3.5 Volume resistivity
Quotient of DC electric field strength in the sample divided by current density.
3.6 Dielectric constant
Ratio of capacitance with dielectric to vacuum capacitance.
3.7 Dielectric dissipation factor
Complementary angle to phase angle between current and voltage phasors in a dielectric.
3.8 Q factor
Evaluation of dielectric electrical properties.
3.9 Dielectric strength
Voltage insulating material can withstand before breakdown per unit thickness.
3.10 Dielectric breakdown
Complete loss of insulation under electric field.
3.11 Comparative tracking index
Enable surface material to withstand electrolyte under electric field.
3.12 Arc resistance
Material ability to withstand electric arc before conducting electricity.
3.13 Dielectric withstanding voltage
Voltage insulator can withstand without breakdown.
3.14 Surface corrosion test
Test to detect electrolytic corrosion of etched conductive patterns.
3.15 Electrolytic corrosion test at the edge
Test to detect substrate corrosion under high humidity and polarization voltage.
4. Non-electrical properties
4.1 Bond strength
Force required to separate adjacent layers of printed boards or laminates.
4.2 Pull off strength
Force to separate land from substrate under axial load.
4.3 Pullout strength
Force to separate metal layer of plated-through hole from substrate under axial load.
4.4 Peel strength
Force to peel off wire or foil from board.
4.5 Bow
Deformation of laminate or board to a plane.
4.6 Twist
Deformation of a rectangular plate plane.
4.7 Camber
Deviation of flex board or flat cable plane from a straight line.
4.8 Coefficient of thermal expansion
Linear change in material size per unit temperature change.
4.9 Thermal conductivity
Heat flow through material.
4.10 Dimensional stability
Measure of dimensional change from external factors.
4.11 Solderability
Ability of metal surfaces to be wetted by molten solder.
4.12 Wetting
Molten solder coating base metal.
4.13 Dewetting
Solder shrinking after covering the base metal.
4.14 Nowetting
Partial adhesion of molten solder to metal.
4.15 Ionizable contaminants
Contaminants forming free ions in water.
4.16 Microsectioning
Sample preparation for material inspection.
4.17 Plated-through hole structure test
Inspection of metal wires and holes after dissolving substrate.
4.18 Solder float test
Sample thermal shock and high temperature resistance test.
4.19 Machinability
Ability of laminates to withstand machining.
4.20 Heat resistance
Ability of sample to resist blistering in oven.
4.21 Hot strength retention
Laminate strength in hot state.
4.22 Flexural strength
Material stress under bending load.
4.23 Tensile strength
Stress withstand by material under a tensile load.
4.24 Elongation
Ratio of distance change under tensile load.
4.25 Tensile modulus of elasticity
Material tensile strain ratio.
4.26 Shear strength
Material stress under shear stress.
4.27 Tear strength
Force to split plastic film.
4.28 Cold flow
Deformation of non-rigid material under continuous load.
4.29 Flammability
Material burning ability under specified conditions.
4.30 Flaming combustion
Combustion of material in the gas phase.
4.31 Glowing combustion
Non-flaming combustion of material.
4.32 Self-extinguishing
Material stops burning after ignition is removed.
4.33 Oxygen index
Oxygen concentration required for material to maintain flame combustion.
4.34 Glass transition temperature
Temperature at which polymer changes state.
4.35 Temperature index
Temperature value corresponding to material thermal life.
4.36 Fungus resistance
Material resistance to mold.
4.37 Chemical resistance
Material resistance to chemical substances.
4.38 Differential scanning calorimetry
Technique for measuring material power difference.
4.39 Thermal mechanical analysis
Measurement of material deformation under temperature.
5. Prepreg materials and adhesive films
5.1 Volatile content
Content of volatile substances in material.
5.2 Resin content
Content of resin in laminate or prepreg.
5.3 Resin flow
Flow properties of material under pressure.
5.4 Gel time
Time for material to pass from solid to liquid to solid.
5.5 Tack time
Time for resin to melt and reach a viscosity for continuous drawing.
5.6 Prepreg cured thickness
Average sheet thickness after pressing material.
Any PCB board that meets the design drawings, relevant specifications, and procurement requirements and is produced in one production batch.
1.2 As Received
The product submitted for acceptance has not been subjected to any conditioning treatment, and it is in the state of mechanical testing under normal atmospheric conditions.
1.3 Test Board
A printed board is produced by the same process and used to determine the acceptability of a batch of printed boards. It represents the quality of the batch of printed boards.
1.4 Test Pattern
A conductive pattern is used to complete a test. The pattern can be a part of the conductive pattern on the production board or a specially designed special test pattern. This test pattern can be placed on the attached test board. The liquid can be placed on a separate test board.
1.5 Composite Test Pattern
A combination of two or more different test patterns, usually placed on a test board.
1.6 Quality Conformance Test Circuit
A complete set of test patterns is included in the build to determine the acceptability of the printed board quality on the build.
1.7 Test Coupon Attached Test Board
A drawing of a portion of a quality conformance test circuit used for a specified acceptance test or set of related tests.
1.8 Storage Life
2. Appearance and size
2.1 Visual examination
Physical features are examined with the naked eye or at specified magnifications.
2.2 Blister
Local separation caused by expansion between substrate layers, substrate and conductive foil, or substrate and protective coating, resulting in delamination.
2.3 Blow hole
Holes caused by exhaust.
2.4 Bulge
Bumps on the printed board or foil due to internal delamination or separation of fibers from resin.
2.5 Circumferential separation
Crack or void in plating around plated-through holes, solder joints, or at joint interfaces.
2.6 Cracking
Breakage in a metallic or non-metallic layer that may extend to the bottom.
2.7 Crazing
Separation of glass fibers from resin in a substrate, manifested as white spots or crosses under the surface.
2.8 Measling
Separation of glass fiber and resin inside the substrate, manifested as scattered white spots or cross patterns under the surface.
2.9 Crazing of conformal coating
Microscopic cracks on the surface and inside conformal coating.
2.10 Delamination
Separation between insulating substrates, insulating substrates and conductive foils, or within a multilayer board.
2.11 Dent
Smooth depressions on the surface of the conductive foil.
2.12 Extraneous copper
Unwanted copper remaining on the substrate after chemical treatment.
2.13 Fiber exposure
Reinforcing fibers exposed due to mechanical processing, abrasion, or chemical attack.
2.14 Weave exposure
Unbroken woven glass fibers not completely covered by resin on the substrate surface.
2.15 Weave texture
Woven glass cloth fibers completely covered by resin, with the weave pattern visible on the surface.
2.16 Wrinkle
Creases or wrinkles on the foil surface.
2.17 Haloing
Destruction or delamination on or under the substrate surface due to machining, manifested as whitish areas around holes.
2.18 Hole breakout
Connection plate not completely surrounding the hole.
2.19 Flare
Tapered hole formed in the substrate during punching.
2.20 Splay
Eccentric, out-of-round, or non-perpendicular holes produced by rotary drilling.
2.21 Void
Lack of substances in a local area.
2.22 Hole void
Hole exposing the substrate within the plated-through hole metallization.
2.23 Inclusion
Foreign particles trapped in substrates, wire layers, plating coatings, or solder joints.
2.24 Lifted land
Land lifted or separated from the substrate, regardless of resin being lifted.
2.25 Nail heading
Copper foil on the inner conductor stretched along the hole wall due to drilling in a multilayer board.
2.26 Nick
2.27 Node
Irregular lumps or nodules protruding from the coating surface.
2.28 Pinhole
Hole completely penetrating a layer of metal.
2.29 Resin recession
Cavity between plated-through hole wall and drilled hole wall, visible in microsection after high-temperature exposure.
2.30 Scratch
2.31 Bump
Protrusions on the conductive foil surface.
2.32 Conductor thickness
2.33 Minimum annular ring
2.34 Registration
Consistency of graphic, hole, or other feature locations on the printed board with specified locations.
2.35 Base material thickness
2.36 Metal-clad laminate thickness
2.37 Resin starved area
Area of laminate with inadequate resin infiltration, showing poor gloss or exposed fibers.
2.38 Resin-rich area
Laminate surface area with significantly thickened resin and no reinforcement.
2.39 Gelation particle
Cured, typically translucent particles in laminate.
2.40 Treatment transfer
Copper foil treatment layer (oxide) transferring to the substrate surface, leaving traces after etching.
2.41 Printed board thickness
Total thickness of substrate and conductive material (including plating) overlying the substrate.
2.42 Total board thickness
Thickness of the printed board, including electroplating and other coating layers.
2.43 Rectangularity
Offset of rectangular plate corners from 90 degrees.
3. Electrical properties
3.1 Contact resistance
Surface resistance at the contact interface under specified conditions.
3.2 Surface resistance
Quotient of DC voltage between two electrodes on the same insulator surface divided by the steady-state current.
3.3 Surface resistivity
Quotient of DC electric field strength at insulator surface divided by current density.
3.4 Volume resistance
Quotient of DC voltage between electrodes on opposite surfaces divided by steady-state current.
3.5 Volume resistivity
Quotient of DC electric field strength in the sample divided by current density.
3.6 Dielectric constant
Ratio of capacitance with dielectric to vacuum capacitance.
3.7 Dielectric dissipation factor
Complementary angle to phase angle between current and voltage phasors in a dielectric.
3.8 Q factor
Evaluation of dielectric electrical properties.
3.9 Dielectric strength
Voltage insulating material can withstand before breakdown per unit thickness.
3.10 Dielectric breakdown
Complete loss of insulation under electric field.
3.11 Comparative tracking index
Enable surface material to withstand electrolyte under electric field.
3.12 Arc resistance
Material ability to withstand electric arc before conducting electricity.
3.13 Dielectric withstanding voltage
Voltage insulator can withstand without breakdown.
3.14 Surface corrosion test
Test to detect electrolytic corrosion of etched conductive patterns.
3.15 Electrolytic corrosion test at the edge
Test to detect substrate corrosion under high humidity and polarization voltage.
4. Non-electrical properties
4.1 Bond strength
Force required to separate adjacent layers of printed boards or laminates.
4.2 Pull off strength
Force to separate land from substrate under axial load.
4.3 Pullout strength
Force to separate metal layer of plated-through hole from substrate under axial load.
4.4 Peel strength
Force to peel off wire or foil from board.
4.5 Bow
Deformation of laminate or board to a plane.
4.6 Twist
Deformation of a rectangular plate plane.
4.7 Camber
Deviation of flex board or flat cable plane from a straight line.
4.8 Coefficient of thermal expansion
Linear change in material size per unit temperature change.
4.9 Thermal conductivity
Heat flow through material.
4.10 Dimensional stability
Measure of dimensional change from external factors.
4.11 Solderability
Ability of metal surfaces to be wetted by molten solder.
4.12 Wetting
Molten solder coating base metal.
4.13 Dewetting
Solder shrinking after covering the base metal.
4.14 Nowetting
Partial adhesion of molten solder to metal.
4.15 Ionizable contaminants
Contaminants forming free ions in water.
4.16 Microsectioning
Sample preparation for material inspection.
4.17 Plated-through hole structure test
Inspection of metal wires and holes after dissolving substrate.
4.18 Solder float test
Sample thermal shock and high temperature resistance test.
4.19 Machinability
Ability of laminates to withstand machining.
4.20 Heat resistance
Ability of sample to resist blistering in oven.
4.21 Hot strength retention
Laminate strength in hot state.
4.22 Flexural strength
Material stress under bending load.
4.23 Tensile strength
Stress withstand by material under a tensile load.
4.24 Elongation
Ratio of distance change under tensile load.
4.25 Tensile modulus of elasticity
Material tensile strain ratio.
4.26 Shear strength
Material stress under shear stress.
4.27 Tear strength
Force to split plastic film.
4.28 Cold flow
Deformation of non-rigid material under continuous load.
4.29 Flammability
Material burning ability under specified conditions.
4.30 Flaming combustion
Combustion of material in the gas phase.
4.31 Glowing combustion
Non-flaming combustion of material.
4.32 Self-extinguishing
Material stops burning after ignition is removed.
4.33 Oxygen index
Oxygen concentration required for material to maintain flame combustion.
4.34 Glass transition temperature
Temperature at which polymer changes state.
4.35 Temperature index
Temperature value corresponding to material thermal life.
4.36 Fungus resistance
Material resistance to mold.
4.37 Chemical resistance
Material resistance to chemical substances.
4.38 Differential scanning calorimetry
Technique for measuring material power difference.
4.39 Thermal mechanical analysis
Measurement of material deformation under temperature.
5. Prepreg materials and adhesive films
5.1 Volatile content
Content of volatile substances in material.
5.2 Resin content
Content of resin in laminate or prepreg.
5.3 Resin flow
Flow properties of material under pressure.
5.4 Gel time
Time for material to pass from solid to liquid to solid.
5.5 Tack time
Time for resin to melt and reach a viscosity for continuous drawing.
5.6 Prepreg cured thickness
Average sheet thickness after pressing material.
