1. This must also depend on whether the part itself has a symbol indicating the polarity of the part, or if the difference in appearance and shape can be implemented.

2. Severe warping can be judged by the difference in the brightness of light reflections, but slight warping can be somewhat difficult to detect. Severe deformation can also be easily detected by using AOI. However, identifying slight warping depends on the specific situation and is often contingent upon the strictness of parameter adjustments.

3. Generally speaking, tin bridging is easy to identify, but if it occurs beneath a component, it becomes challenging to detect. For instance, some connectors may have tin bridges concealed beneath the component body, making them undetectable by AOI.

4. Therefore, the circuit board production line not only employs AOI to ensure quality but also incorporates ICT (In-Circuit Test) and FVT (Functional Test). Some production lines may additionally utilize AXI (Automatic X-ray Inspection) to inspect solder joint quality, particularly for components such as BGAs, along the line using X-ray technology.

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