PCBA foundry substitutes are a well-known topic today. Notably, there is a distinction between leaded and lead-free processes during proofing. Lead poses health risks; hence, the lead-free process is the prevailing trend. Below, we explore the advantages of PCBA foundry materials and the differences between the leaded and lead-free processes.
1. The distinction between leaded and lead-free processes in PCBA proofing:
1. The alloy compositions differ: the common tin-lead composition for the leaded process is 63/37, whereas the lead-free alloy composition is SAC 305, comprising Sn: 96.5%, Ag: 3%, and Cu: 0.5%. While the lead-free process cannot guarantee complete absence of lead, it typically contains very low levels, such as lead below 500 PPM.
2. **Different melting points:** The melting point of lead-tin ranges from 180° to 185°, with a working temperature of approximately 240° to 250°. In contrast, the melting point of lead-free tin lies between 210° and 235°, and its working temperature is around 245° to 280°. Experience suggests that for every 8% to 10% increase in tin content, the melting point rises by about 10 degrees, and the working temperature increases by 10 to 20 degrees.
3. **Cost variations:** Tin is generally more expensive than lead. Thus, when tin replaces lead in solder, the solder’s cost increases significantly. Consequently, the expenses associated with lead-free processes are substantially higher than those of lead-based processes. Statistics reveal that the cost of tin bars for wave soldering and tin wires for manual soldering in lead-free processes is 2.7 times that of lead processes, while solder paste for reflow soldering sees a cost increase of about 1.5 times.
4. **Process differences:** While the names indicate a distinction between lead and lead-free processes, the specifics—such as the solder, components, and equipment used (like wave soldering furnaces, solder paste printers, and manual soldering irons)—differ significantly. This variance is a primary reason why managing both leaded and lead-free processes simultaneously poses challenges for small-scale PCBA processing plants.
**PCBA foundry materials**
**Second, the advantages of PCBA foundry materials:**
1. As is widely recognized, companies aiming to optimize their production require a certain minimum order quantity (MOQ). Due to the high cost associated with MOQ, many small and medium enterprises, when starting, may struggle if they adopt the PCB OEM model. However, with industry advancements, a small PCB OEM model has emerged, enabling companies to engage in OEM activities even with minimal product sets. This significantly lowers the entry barrier for batch production, allowing more electronic products to transition directly into the foundry phase after design completion, thereby greatly reducing the production cycle.
2. Previously, initiating PCBA OEM and materials business required manufacturers to maintain substantial production batches. Insufficient production volumes often led to significant additional management costs for manufacturers. However, the evolution of the foundry industry has introduced options for small enterprises, alleviating previous concerns. Now, manufacturers only adjust costs appropriately based on the customer’s order, rather than passing management costs directly onto customers. This approach not only enhances customer acceptance but also lowers the barriers for businesses to begin operations.
1. The distinction between leaded and lead-free processes in PCBA proofing:
1. The alloy compositions differ: the common tin-lead composition for the leaded process is 63/37, whereas the lead-free alloy composition is SAC 305, comprising Sn: 96.5%, Ag: 3%, and Cu: 0.5%. While the lead-free process cannot guarantee complete absence of lead, it typically contains very low levels, such as lead below 500 PPM.
2. **Different melting points:** The melting point of lead-tin ranges from 180° to 185°, with a working temperature of approximately 240° to 250°. In contrast, the melting point of lead-free tin lies between 210° and 235°, and its working temperature is around 245° to 280°. Experience suggests that for every 8% to 10% increase in tin content, the melting point rises by about 10 degrees, and the working temperature increases by 10 to 20 degrees.
3. **Cost variations:** Tin is generally more expensive than lead. Thus, when tin replaces lead in solder, the solder’s cost increases significantly. Consequently, the expenses associated with lead-free processes are substantially higher than those of lead-based processes. Statistics reveal that the cost of tin bars for wave soldering and tin wires for manual soldering in lead-free processes is 2.7 times that of lead processes, while solder paste for reflow soldering sees a cost increase of about 1.5 times.
4. **Process differences:** While the names indicate a distinction between lead and lead-free processes, the specifics—such as the solder, components, and equipment used (like wave soldering furnaces, solder paste printers, and manual soldering irons)—differ significantly. This variance is a primary reason why managing both leaded and lead-free processes simultaneously poses challenges for small-scale PCBA processing plants.
**PCBA foundry materials**
**Second, the advantages of PCBA foundry materials:**
1. As is widely recognized, companies aiming to optimize their production require a certain minimum order quantity (MOQ). Due to the high cost associated with MOQ, many small and medium enterprises, when starting, may struggle if they adopt the PCB OEM model. However, with industry advancements, a small PCB OEM model has emerged, enabling companies to engage in OEM activities even with minimal product sets. This significantly lowers the entry barrier for batch production, allowing more electronic products to transition directly into the foundry phase after design completion, thereby greatly reducing the production cycle.
2. Previously, initiating PCBA OEM and materials business required manufacturers to maintain substantial production batches. Insufficient production volumes often led to significant additional management costs for manufacturers. However, the evolution of the foundry industry has introduced options for small enterprises, alleviating previous concerns. Now, manufacturers only adjust costs appropriately based on the customer’s order, rather than passing management costs directly onto customers. This approach not only enhances customer acceptance but also lowers the barriers for businesses to begin operations.
