It is evident from the following discussion that the variability in prices of FPC flexible circuit boards is inherently unavoidable.
1. The variety of materials utilized in flexible circuit boards leads to price diversity.
For instance, consider a standard double-sided board. The substrate materials typically include PET, PI, and others. The thickness of these substrates ranges from 0.0125mm to 0.10mm, while the copper thickness can vary from 1/2Oz to 3Oz. Price variations also arise from different brands of materials, contributing to the overall price diversity. These materials typically encompass PI, FCCL, copper foil, reinforcement materials, and auxiliary components.
2. The use of different production processes in flexible circuit boards results in varying costs.
Distinct manufacturing methods lead to different expenses. For example, gold-plated boards and tin-sprayed boards have differing costs associated with production precision, the application of silk-screened lines, and dry film lines. These factors ultimately contribute to the range of prices observed.
1. Third, price diversity arises from the inherent complexity of flexible circuit boards.
2. Even with identical materials and processes, variations in the complexity of flexible circuit boards lead to differing costs.
3. For instance, if two boards each have 1,000 holes, the drilling costs will vary if one board has holes larger than 0.6mm while the other has holes smaller than 0.6mm.
4. Similarly, if both boards are the same but differ in line width and spacing—one exceeding 0.15mm and the other falling below—this too will influence production costs, as the more complex design tends to have a higher scrap rate, thereby increasing overall costs and contributing to price diversity.
5. Fourth, varying customer requirements also play a role in price differences.
6. The standards set by customers directly impact the production efficiency of the board factory.
7. For example, a board meeting IPC-A-6013, class 1 specifications may require a 98% pass rate, while class 3 may only necessitate a 90% pass rate, leading to different costs for the manufacturer and ultimately resulting in fluctuating product prices.
8. Fifth, price diversity is influenced by the varying flexible circuit board manufacturers.
9. Even for the same product, differing process equipment and technical expertise among FPC manufacturers can lead to distinct costs.
10. Many manufacturers prefer gold-plated boards due to simpler processes and lower costs; however, increased scrap rates in some companies can raise costs, prompting them to favor tin-sprayed or tin-plated panels, thus resulting in lower quotes for tin options compared to gold-plated ones.
11. Sixth, price differences can also arise from various payment methods.
12. Currently, flexible circuit board manufacturers often adjust their pricing based on payment methods, which can vary by 5% to 10%, creating further price discrepancies.
13. Seventh, geographic location contributes to price diversity.
14. In China, prices tend to increase from south to north, resulting in regional price variations.
15. Eighth, different electroplating methods yield varying costs.
16. Partial electroplating typically costs about 15% less than full electroplating.
17. Ninth, the choice of surface treatment for the gold finger area impacts pricing as well.
18. The cost difference between gold plating and tin plating is approximately 5%.
19. Tenth, the defect rate during the FPC production process significantly affects the unit price of FPC.
20. Eleventh, the costs associated with SMT on behalf of customers and the level of defects also determine the unit price of FPC.
1. The variety of materials utilized in flexible circuit boards leads to price diversity.
For instance, consider a standard double-sided board. The substrate materials typically include PET, PI, and others. The thickness of these substrates ranges from 0.0125mm to 0.10mm, while the copper thickness can vary from 1/2Oz to 3Oz. Price variations also arise from different brands of materials, contributing to the overall price diversity. These materials typically encompass PI, FCCL, copper foil, reinforcement materials, and auxiliary components.
2. The use of different production processes in flexible circuit boards results in varying costs.
Distinct manufacturing methods lead to different expenses. For example, gold-plated boards and tin-sprayed boards have differing costs associated with production precision, the application of silk-screened lines, and dry film lines. These factors ultimately contribute to the range of prices observed.
1. Third, price diversity arises from the inherent complexity of flexible circuit boards.
2. Even with identical materials and processes, variations in the complexity of flexible circuit boards lead to differing costs.
3. For instance, if two boards each have 1,000 holes, the drilling costs will vary if one board has holes larger than 0.6mm while the other has holes smaller than 0.6mm.
4. Similarly, if both boards are the same but differ in line width and spacing—one exceeding 0.15mm and the other falling below—this too will influence production costs, as the more complex design tends to have a higher scrap rate, thereby increasing overall costs and contributing to price diversity.
5. Fourth, varying customer requirements also play a role in price differences.
6. The standards set by customers directly impact the production efficiency of the board factory.
7. For example, a board meeting IPC-A-6013, class 1 specifications may require a 98% pass rate, while class 3 may only necessitate a 90% pass rate, leading to different costs for the manufacturer and ultimately resulting in fluctuating product prices.
8. Fifth, price diversity is influenced by the varying flexible circuit board manufacturers.
9. Even for the same product, differing process equipment and technical expertise among FPC manufacturers can lead to distinct costs.
10. Many manufacturers prefer gold-plated boards due to simpler processes and lower costs; however, increased scrap rates in some companies can raise costs, prompting them to favor tin-sprayed or tin-plated panels, thus resulting in lower quotes for tin options compared to gold-plated ones.
11. Sixth, price differences can also arise from various payment methods.
12. Currently, flexible circuit board manufacturers often adjust their pricing based on payment methods, which can vary by 5% to 10%, creating further price discrepancies.
13. Seventh, geographic location contributes to price diversity.
14. In China, prices tend to increase from south to north, resulting in regional price variations.
15. Eighth, different electroplating methods yield varying costs.
16. Partial electroplating typically costs about 15% less than full electroplating.
17. Ninth, the choice of surface treatment for the gold finger area impacts pricing as well.
18. The cost difference between gold plating and tin plating is approximately 5%.
19. Tenth, the defect rate during the FPC production process significantly affects the unit price of FPC.
20. Eleventh, the costs associated with SMT on behalf of customers and the level of defects also determine the unit price of FPC.
