PCBA labor and materials represent a comprehensive service, encompassing numerous stages, each of which can influence the quality of the final product. Let’s discuss several critical points in PCBA labor and materials that are essential for ensuring quality:
1. SMT Patch Processing
The systematic quality control of solder paste printing and the management of reflow soldering temperatures in SMT chip processing are pivotal stages in the PCBA manufacturing workflow. Additionally, for the printing of high-precision circuit boards with specialized and complex processes, laser stencils must be utilized under specific conditions to achieve superior quality and processing standards. Depending on PCB manufacturing specifications and the unique characteristics of customer products, there may be a need to incorporate U-shaped holes or reduce the size of mesh holes. The steel mesh must be processed according to the specifications of the PCBA processing technology.
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1. Among the various factors, the temperature control accuracy of the reflow oven is crucial for the wetting of the solder paste and the strength of the stencil welding. This can be adjusted according to the standard SOP operation guide, aiming to minimize quality defects during PCBA patch processing in the SMT phase. Moreover, strict adherence to the AOI test can significantly reduce defects attributed to human error.
2. DIP plug-in post soldering represents the most critical and final stage in the circuit board processing workflow. During this phase, the design of the furnace jig for wave soldering plays a pivotal role. Effectively utilizing the furnace fixture can enhance yield rates and diminish soldering defects, such as bridging, insufficient solder, and solder shortages. In response to varying customer product requirements, PCBA processing plants must continually gather practical insights to facilitate technological advancements.
3. The manufacturability report is a vital evaluation that should be conducted prior to commencing full production after receiving a customer’s contract. The earlier DFM report allows us to offer key suggestions to the customer before PCB processing. For instance, establishing crucial test points on the PCB can assist in verifying circuit continuity and connectivity post-soldering and during subsequent PCBA processing. When feasible, engage with the customer to provide backend programming, enabling the burning of the PCBA program into the core master IC using a burner. This method allows for streamlined testing through touch actions, ensuring the integrity of the entire PCBA and facilitating the timely identification of defective products.
4. Additionally, many customers seeking comprehensive PCBA package labor and materials often require back-end testing for PCBA. Such testing typically encompasses ICT (In-Circuit Testing), FCT (Functional Testing), burn tests (aging tests), temperature and humidity tests, drop tests, and more.
