The Evolution of Printed Circuits: A Brief History

Printed circuits have come a long way since their inception in the early 20th century. The breakthrough came in the 1950s when the adhesion issue between copper foil and layers was finally resolved, paving the way for stable and reliable performance of copper-clad laminate. This development marked a significant shift towards copper foil etching as the primary manufacturing technology, enabling mass production of surface printing and multi-layer printed boards.

Subsequent decades brought rapid advancements in integrated circuits, electronic calculators, surface mount technology in the 1980s, and the rise of multi-chip assembly technology in the 1990s. These innovations propelled the evolution of printed circuit production towards high-density, thin wire, multi-layer boards with high reliability, low cost, and automated continuous production.

The Design Process of The Schematic Diagram

  • Creating Logical Components
    • Defining logical component models
    • Specifying package form of logic component pins
    • Describing logic component pins
    • Defining the shape and symbol size of logic components
  • Describing Functional Characteristics of Logic Components
    • Detailing timing relationships, delay times, etc.
  • Managing the Logic Component Library
    • Categorizing logic components based on their functional characteristics or manufacturer

The Function of Printed Circuits In Electronic Equipment

  • Providing mechanical support for fixating and assembling electronic components.
  • Facilitating wiring, electrical connections, and insulation.
  • Offering required electrical characteristics such as characteristic impedance.
  • Providing solder mask graphics for automatic soldering, as well as identifiers and graphics for component insertion, inspection, and maintenance.
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