1. The distinction between PCB hard boards and FPC soft boards
Hard board: PCB (Printed Circuit Board); Soft board: FPC or FPCB (Flexible Printed Circuit Board); Rigid-flexible board: RFPC or RFPCB (Rigid-Flex Printed Circuit Board). As the name suggests, it combines features of both hard and soft boards, representing a new type of circuit board. The hard board section resembles a traditional PCB, possessing a certain thickness and strength that allows for the installation of electronic components and the ability to withstand mechanical forces. In contrast, the soft board section is typically utilized for three-dimensional installations. The integration of these two types results in a hybrid board that can be locally bent.
FPC: FPC, also referred to as flexible circuit board, offers the advantage of being bendable. The flexible printed circuit board (Flexible Printed Circuit, FPC), also known as a flexible circuit board, is appreciated for its lightweight, thin profile, and excellent ability to bend and fold. However, in domestic quality control for FPCs, manual visual inspection is still the primary method, leading to high costs and low efficiency.
With the rapid advancement of the electronics industry, circuit board design is becoming increasingly precise and densely packed. Traditional manual inspection methods can no longer satisfy production demands. The automatic detection of FPC defects has become an essential trend in the industry’s evolution.
2. FPC Manufacturer’s Soft Board Soldering Process
The following section outlines the manual soldering processes commonly used by FPC manufacturers: manual drag soldering involves using an electric soldering iron and tin wire to join solder connections. For FPC soldering, the use of an OKi soldering iron and A tin wire is highly recommended.
Currently, there are two primary soldering techniques employed by FPC manufacturers: tin press welding and manual drag welding. Generally, tin press welding is advised due to its advantages, which include smooth joints and reduced occurrences of false soldering, short circuits, and other defects. However, it comes with higher costs, and careful consideration of component layout is necessary during board design. Here, we will focus on the manual soldering process: manual drag soldering involves using an electric soldering iron and tin wire to create the necessary solder connections. The recommended tools for FPC soldering remain the OKi soldering iron and A tin wire.
The key sequence in FPC welding is as follows: FPC paste alignment, tin delivery and drag welding, visual inspection, and electrical testing. During FPC paste alignment, it is crucial to ensure that the FPC pad and the corresponding solder surface are both flat and free of oxidation prior to alignment. After applying the paste, the pad should expose approximately 1.00mm of pin to facilitate effective soldering.
The primary control parameters for FPC manufacturers’ soft boards include:
1. Time: Before soldering, the soldering iron should rest on the pad for 2-3 seconds to ensure that both the FPC and the pad are adequately heated, which effectively minimizes the risk of false soldering;
2. Position: The angle of the soldering iron relative to the gold finger should be approximately 30 degrees.
There are four main control points to consider during the soldering and drag welding of FPC manufacturers’ soft boards:
1. Time: The recommended duration is typically calculated as 3 seconds divided by the length of the soldering iron tip, resulting in an approximate range of 4-10 seconds;
2. Temperature: The ideal temperature range is between 290 and 310 degrees Celsius;
3. Tin delivery position: The tin should be positioned closer to the soldering pad;
4. Strength: When the soldering iron tip makes contact with the components, a slight pressure should be applied, ensuring it does not damage the gold fingers.
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Hard board: PCB (Printed Circuit Board); Soft board: FPC or FPCB (Flexible Printed Circuit Board); Rigid-flexible board: RFPC or RFPCB (Rigid-Flex Printed Circuit Board). As the name suggests, it combines features of both hard and soft boards, representing a new type of circuit board. The hard board section resembles a traditional PCB, possessing a certain thickness and strength that allows for the installation of electronic components and the ability to withstand mechanical forces. In contrast, the soft board section is typically utilized for three-dimensional installations. The integration of these two types results in a hybrid board that can be locally bent.
FPC: FPC, also referred to as flexible circuit board, offers the advantage of being bendable. The flexible printed circuit board (Flexible Printed Circuit, FPC), also known as a flexible circuit board, is appreciated for its lightweight, thin profile, and excellent ability to bend and fold. However, in domestic quality control for FPCs, manual visual inspection is still the primary method, leading to high costs and low efficiency.
With the rapid advancement of the electronics industry, circuit board design is becoming increasingly precise and densely packed. Traditional manual inspection methods can no longer satisfy production demands. The automatic detection of FPC defects has become an essential trend in the industry’s evolution.
2. FPC Manufacturer’s Soft Board Soldering Process
The following section outlines the manual soldering processes commonly used by FPC manufacturers: manual drag soldering involves using an electric soldering iron and tin wire to join solder connections. For FPC soldering, the use of an OKi soldering iron and A tin wire is highly recommended.
Currently, there are two primary soldering techniques employed by FPC manufacturers: tin press welding and manual drag welding. Generally, tin press welding is advised due to its advantages, which include smooth joints and reduced occurrences of false soldering, short circuits, and other defects. However, it comes with higher costs, and careful consideration of component layout is necessary during board design. Here, we will focus on the manual soldering process: manual drag soldering involves using an electric soldering iron and tin wire to create the necessary solder connections. The recommended tools for FPC soldering remain the OKi soldering iron and A tin wire.
The key sequence in FPC welding is as follows: FPC paste alignment, tin delivery and drag welding, visual inspection, and electrical testing. During FPC paste alignment, it is crucial to ensure that the FPC pad and the corresponding solder surface are both flat and free of oxidation prior to alignment. After applying the paste, the pad should expose approximately 1.00mm of pin to facilitate effective soldering.
The primary control parameters for FPC manufacturers’ soft boards include:
1. Time: Before soldering, the soldering iron should rest on the pad for 2-3 seconds to ensure that both the FPC and the pad are adequately heated, which effectively minimizes the risk of false soldering;
2. Position: The angle of the soldering iron relative to the gold finger should be approximately 30 degrees.
There are four main control points to consider during the soldering and drag welding of FPC manufacturers’ soft boards:
1. Time: The recommended duration is typically calculated as 3 seconds divided by the length of the soldering iron tip, resulting in an approximate range of 4-10 seconds;
2. Temperature: The ideal temperature range is between 290 and 310 degrees Celsius;
3. Tin delivery position: The tin should be positioned closer to the soldering pad;
4. Strength: When the soldering iron tip makes contact with the components, a slight pressure should be applied, ensuring it does not damage the gold fingers.
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Let me know if you need any more adjustments!
