The Difference Between Immersion Gold PCB Board and Gold-Plated PCB Board
1. The crystal structure formed by immersion gold and gold plating differs significantly. Immersion gold has a much thicker thickness compared to gold plating, resulting in a more golden yellow appearance that customers generally prefer.
2. In addition to the crystal structure, immersion gold allows for easier welding compared to gold plating, reducing the likelihood of poor welding and customer complaints. The stress on immersion gold plates is more manageable, particularly beneficial for products requiring bonding processes. Additionally, due to its softer nature, immersion gold is more precise and less wear-resistant, especially for gold finger applications.
3. Immersion gold boards only feature nickel-gold on the pad, ensuring that signal transmission in the skin effect remains within the copper layer without affecting the signal integrity.
4. Immersion gold boasts a denser crystal structure and is less prone to oxidation compared to gold plating.
5. For densely packed wiring with line widths and spacing reaching 3-4MIL, gold plating may lead to short circuits of gold wires. In contrast, immersion gold boards, featuring nickel gold only on the pad, prevent such short circuits.
6. The combination of solder mask on the circuit and the copper layer on immersion gold boards is stronger due to the presence of nickel-gold only on the pad, ensuring that spacing remains uncompromised.
7. Immersion gold is typically preferred for boards with high quality requirements and superior flatness. The occurrence of the black pad phenomenon after assembly is less common with immersion gold boards. The flatness and shelf life of immersion gold plates are generally comparable to those of gold-plated plates.
1. The crystal structure formed by immersion gold and gold plating differs significantly. Immersion gold has a much thicker thickness compared to gold plating, resulting in a more golden yellow appearance that customers generally prefer.
2. In addition to the crystal structure, immersion gold allows for easier welding compared to gold plating, reducing the likelihood of poor welding and customer complaints. The stress on immersion gold plates is more manageable, particularly beneficial for products requiring bonding processes. Additionally, due to its softer nature, immersion gold is more precise and less wear-resistant, especially for gold finger applications.
3. Immersion gold boards only feature nickel-gold on the pad, ensuring that signal transmission in the skin effect remains within the copper layer without affecting the signal integrity.
4. Immersion gold boasts a denser crystal structure and is less prone to oxidation compared to gold plating.
5. For densely packed wiring with line widths and spacing reaching 3-4MIL, gold plating may lead to short circuits of gold wires. In contrast, immersion gold boards, featuring nickel gold only on the pad, prevent such short circuits.
6. The combination of solder mask on the circuit and the copper layer on immersion gold boards is stronger due to the presence of nickel-gold only on the pad, ensuring that spacing remains uncompromised.
7. Immersion gold is typically preferred for boards with high quality requirements and superior flatness. The occurrence of the black pad phenomenon after assembly is less common with immersion gold boards. The flatness and shelf life of immersion gold plates are generally comparable to those of gold-plated plates.
