Latest Research Findings in PCB Etching Process

A recent research study in the PCM industrial system has revealed groundbreaking results that are yet to be officially published. The study, backed by substantial project funding, focuses on revolutionizing the design concepts of etching devices for long-term efficacy.

Nozzle Design Optimization

One key innovation involves the transition from conical nozzles to fan-shaped nozzles, enhancing the spray efficiency within the etching chamber. By adjusting the installation angle of the spray manifold to 30 degrees, the new design ensures uniform spray coverage on the workpiece, eliminating inconsistencies caused by varying spray angles.

Optimal Spray Pressure

The study has identified 65 pounds per square inch (4+Bar) as the latest optimal spray pressure parameter for efficient etching processes. Maintaining a spray pressure of 30 pounds per square inch (2Bar) or higher is crucial for achieving desired results, with the pressure requirement varying based on the density and mobility of the etching solution.

Equipment Maintenance Tips

Proper maintenance of etching equipment is essential for optimal performance. Regular cleaning of nozzles to prevent blockages is critical to ensuring uninterrupted jetting. Additionally, replacing worn-out parts, especially nozzles prone to wear, is necessary to avoid uneven etching and potential PCB damage. Preventing slag accumulation in the etching machine is equally vital, as excessive slagging can disrupt the chemical balance of the solution. Addressing slag buildup promptly with appropriate cleaning measures, such as using strong hydrochloric acid, is essential for maintaining operational efficiency.