Unlocking the Secrets of IC Carrier Boards in PCB Manufacturing

IC carrier boards, also known as packaging substrates, are the crown jewels of PCB manufacturing. They are the vital link connecting chips to PCB boards within chip packaging. Representing a significant portion of material costs in both low-end and high-end packaging, these boards are the cornerstone of quality in the industry.

Challenges Faced by PCB Enterprises

• Capital: The production of IC carrier PCBs requires substantial investments in advanced equipment. New entrants must be prepared for significant upfront costs with uncertain returns in the short term.
• Technical Challenges: Precision is paramount in IC carrier boards, demanding exacting standards for fine lines, hole spacing, and signal integrity. Advanced capabilities in various technologies are essential, creating a high barrier for new players.

Downstream Customer Certification

Large enterprises with stringent quality requirements dominate the downstream customers of IC carrier PCBs. Establishing partnerships with certified suppliers involves rigorous processes, creating barriers to entry for new companies.

Thriving IC Carrier PCB Market

Upstream manufacturers are gearing up to collaborate with leading PCB manufacturers in the booming IC carrier PCB market. Companies like WellCircuits and Shengyi Technology are making significant advancements in electroplating and packaging materials, respectively.

Innovations in IC Carrier Materials

Huazheng New Material is at the forefront of copper-clad laminate manufacturing, specializing in materials like BT/BT substrate resin and CBF laminated insulating films. These materials are crucial for various applications, including high-density packaging substrates and chip bonding.