3. Adhesive

Adhesive is used in SMT chip processing to bond components to the substrate. It is essential for ensuring the stability and reliability of the solder joints, and for protecting the components from external forces and environmental influences.

4. Cleaning agent

Cleaning agent is used to remove flux residues and other contaminants from the surface of the PCB after soldering. It is crucial for ensuring the cleanliness of the PCB and the reliability of the solder joints.

5. Heat transfer medium

Heat transfer medium is used in reflow soldering to provide uniform and efficient heat transfer to the solder joints. It helps to ensure proper soldering and minimize defects in the solder joints.

In conclusion, selecting the appropriate process materials is crucial for ensuring the quality and production efficiency of SMT chip processing. Each type of material plays a specific and vital role in the overall process, and proper selection and use of these materials are essential for achieving high-quality and reliable SMT chip products.

3. Adhesive

Adhesive is the bonding material used in SMT patches. During the wave soldering process, components are typically pre-fixed on the PCB using adhesive. Even when reflow soldering is used to assemble SMDs on both sides of the PCB, adhesive is often applied to the center of the PCB land pattern to enhance the fixation of the SMDs and prevent them from shifting or falling during assembly.

4. Cleaning Agent

Cleaning agent is used in SMT patches to remove residue left on the board after the soldering process. Currently, cleaning remains an essential part of the patch process, with solvent cleaning being the most effective method.

SMT processing materials form the foundation of the patch process, with assembly process materials selected according to the specific assembly processes and requirements.