However, with the evolution of technology, the size of printed circuit boards (PCBs) has become increasingly smaller. It is becoming more challenging to accommodate numerous electronic components on these compact circuit boards. Consequently, the issue of test points taking up valuable PCB space often becomes a point of contention between the design and manufacturing teams. Test points typically have a round shape to align with the shape of the probes, making production easier and allowing for a higher density of probes in the needle bed.
Using a needle bed for circuit testing does come with limitations. For instance, there is a minimum diameter limit for the probes, as excessively small needles are susceptible to breakage and damage. The spacing between needles is also restricted, as each needle needs to be soldered to a flat cable and exit through a hole. If the holes are too close together, it can result in contact short circuits and interference from the flat cable.
Furthermore, needles cannot be placed too close to taller components, as this poses a risk of collision and potential damage. In some cases, a hole needs to be made in the needle bed to accommodate these taller components, restricting the placement of test points. As PCBs continue to shrink in size, accommodating test points for all components is becoming increasingly difficult.
As discussions about reducing test points persist, alternative testing methods such as Net test, Test Jet, Boundary Scan, and JTAG have emerged. While methods like AOI and X-Ray aim to replace traditional needle bed testing, it is clear that none can fully replace ICT 100%.
When considering the feasibility of ICT needle implantation, it is advisable to consult with the fixture manufacturer regarding the minimum probe diameter and spacing between test points. Manufacturers may have specific requirements for these values to prevent damage to the fixture.
Using a needle bed for circuit testing does come with limitations. For instance, there is a minimum diameter limit for the probes, as excessively small needles are susceptible to breakage and damage. The spacing between needles is also restricted, as each needle needs to be soldered to a flat cable and exit through a hole. If the holes are too close together, it can result in contact short circuits and interference from the flat cable.
Furthermore, needles cannot be placed too close to taller components, as this poses a risk of collision and potential damage. In some cases, a hole needs to be made in the needle bed to accommodate these taller components, restricting the placement of test points. As PCBs continue to shrink in size, accommodating test points for all components is becoming increasingly difficult.
As discussions about reducing test points persist, alternative testing methods such as Net test, Test Jet, Boundary Scan, and JTAG have emerged. While methods like AOI and X-Ray aim to replace traditional needle bed testing, it is clear that none can fully replace ICT 100%.
When considering the feasibility of ICT needle implantation, it is advisable to consult with the fixture manufacturer regarding the minimum probe diameter and spacing between test points. Manufacturers may have specific requirements for these values to prevent damage to the fixture.
