The impact of lead-free regulatory development on PCB board assembly
Lead-containing solder and lead alloy surface mount technology (SMT) have been widely used in electronic product manufacturing technology for a long time, especially Sn-Pb eutectic solder, with its ease of use, stable solderability, and affordable price. This practical low-temperature alloy also offers unique properties such as a low melting point, good ductility, good fatigue resistance, high thermal cycle, good electrical conductivity, and high bonding, making it very suitable for electronic products. In the current high-density electronic industry assembly process, it has played a crucial and widely used role.
Lead-based solder serves three functions in electronic connections: completing the surface treatment of the printed circuit board, coating the surface of the part to provide a solderable surface, and soldering the electronic part to the printed circuit board. While many PCB board manufacturers are implementing PWB surface treatment actions using new alternatives such as organic soldering materials (OSPs) to replace lead-containing solder, lead solder still dominates the market and remains the primary solder option.
With the widespread use and convenience of electronic products in the household or consumer market, there is a growing concern about end-of-life disposal. Whether electronic products are buried or incinerated at the end of their lifecycle, the eventual release of lead into the environment through environmental media can result in irreparable lead pollution, posing significant harm to the earth’s environment and human survival.
Regulatory and Specification Requirements
Many regulations currently in effect or under review have a significant impact on “lead-free electronics”. Therefore, the definition of “lead-free” for these regulations and their related requirements has become a crucial aspect that we must understand. In the U.S., water pipe solders and fluxes with lead content below 0.2% are considered lead-free. In Europe, the standard recognized by ISO is 0.1%, the standard recognized by the EU End of Life and Hazardous Substances Prohibition Directive is also 0.1%. However, there is still no clear lead-free definition for electronic assembly.
US regulations
Relevant legislative activities in various states in the United States: Although no states require lead-free products, some states are starting to focus on recycling electronic products due to recognizing the long-term environmental hazards of electronic materials. The Electronic Recycling Directive (ERI) provides ongoing monitoring of activities at both the state and national levels.
Japanese regulations
Currently, there are no pending domestic regulations specifically calling for a ban on lead. However, the Japanese Ministry of Trade proposed recycling legislation in May 1998 to encourage reducing the use of lead for increased recycling. Japan’s Residential Electronics Recycling Law, renovated in 1998, requires OEMs to prepare for the collection and recycling of specific products. While this law does not address the use of lead-containing products, another regulation prohibits companies from releasing toxic waste into the environment.
EU regulations
WEEE/RoHS: In response to pressure from EU countries, the EC initiated legislation to control toxic elements in electronic equipment. The “Waste Electrical and Electronic Equipment (WEEE) Directive and Restriction of Hazardous Substances (RoHS) Directive” (2002/10) received significant attention from the electronics industry. The directive includes responsibilities for recycling and reusing materials after they exit the product. Additionally, the End-of-life Vehicle Directive specifies recycling and reusing responsibilities for automotive products while regulating the content of lead, cadmium, mercury, chromium, and polyvinyl chloride to limit their presence in products. This directive also addresses the quality control operation of Lead-Free PCB Assembly.
Purpose
The purpose is to ensure compliance for suppliers converting products to lead-free/hazardous substance-free while ensuring process and product reliability with lead-free solder, hazardous substance compliance, and material compliance.
Process
(1) Manufacturers must document compliance with lead-free/hazardous substance prohibitions for all changes to existing parts as per JESD46-B. Any part changes must comply with lead-free/hazardous substance prohibitions for significant changes.
(2) Discontinuation of existing parts must be notified to the client as per JESD48-A.
(3) Manufacturers must notify customers before producing lead-free/hazardous substance prohibited compliant products and provide a technical roadmap indicating planned changes and implementation schedules. Details on feasibility, recent product developments, life cycle information, and compliant products must be specified.
Compatibility and Testing
A quality approval for a packaged lead-free part shall include various tests such as manual, package, transport, use, solderability test, reliability test, mechanical shock and vibration test, high-temperature storage test, tin whisker growth test, and MSL testing. The comparison between old and new parts should be included in the feasible test.
Parts Confirmation
All parts must have external and internal packaging materials marked with lead-free/hazardous substance prohibition traceability information. The new supplier’s P/N must be included, and the component’s data page should clearly indicate terminal solder composition, temperature values, reflow profile, and humidity sensitivity. If this information is not present, a clear reference should be provided. Standard JEDEC JESD97 should be followed for lead-free/hazardous substance-prohibited product identification and labeling.
Compliance
Verification of “Hazardous Substance Prohibition Compliance” requires the generation and submission of documents confirming the method and result. This verification must be handled as per the guidelines established by industry associations on PCB boards.
Lead-containing solder and lead alloy surface mount technology (SMT) have been widely used in electronic product manufacturing technology for a long time, especially Sn-Pb eutectic solder, with its ease of use, stable solderability, and affordable price. This practical low-temperature alloy also offers unique properties such as a low melting point, good ductility, good fatigue resistance, high thermal cycle, good electrical conductivity, and high bonding, making it very suitable for electronic products. In the current high-density electronic industry assembly process, it has played a crucial and widely used role.
Lead-based solder serves three functions in electronic connections: completing the surface treatment of the printed circuit board, coating the surface of the part to provide a solderable surface, and soldering the electronic part to the printed circuit board. While many PCB board manufacturers are implementing PWB surface treatment actions using new alternatives such as organic soldering materials (OSPs) to replace lead-containing solder, lead solder still dominates the market and remains the primary solder option.
With the widespread use and convenience of electronic products in the household or consumer market, there is a growing concern about end-of-life disposal. Whether electronic products are buried or incinerated at the end of their lifecycle, the eventual release of lead into the environment through environmental media can result in irreparable lead pollution, posing significant harm to the earth’s environment and human survival.
Regulatory and Specification Requirements
Many regulations currently in effect or under review have a significant impact on “lead-free electronics”. Therefore, the definition of “lead-free” for these regulations and their related requirements has become a crucial aspect that we must understand. In the U.S., water pipe solders and fluxes with lead content below 0.2% are considered lead-free. In Europe, the standard recognized by ISO is 0.1%, the standard recognized by the EU End of Life and Hazardous Substances Prohibition Directive is also 0.1%. However, there is still no clear lead-free definition for electronic assembly.
US regulations
Relevant legislative activities in various states in the United States: Although no states require lead-free products, some states are starting to focus on recycling electronic products due to recognizing the long-term environmental hazards of electronic materials. The Electronic Recycling Directive (ERI) provides ongoing monitoring of activities at both the state and national levels.
Japanese regulations
Currently, there are no pending domestic regulations specifically calling for a ban on lead. However, the Japanese Ministry of Trade proposed recycling legislation in May 1998 to encourage reducing the use of lead for increased recycling. Japan’s Residential Electronics Recycling Law, renovated in 1998, requires OEMs to prepare for the collection and recycling of specific products. While this law does not address the use of lead-containing products, another regulation prohibits companies from releasing toxic waste into the environment.
EU regulations
WEEE/RoHS: In response to pressure from EU countries, the EC initiated legislation to control toxic elements in electronic equipment. The “Waste Electrical and Electronic Equipment (WEEE) Directive and Restriction of Hazardous Substances (RoHS) Directive” (2002/10) received significant attention from the electronics industry. The directive includes responsibilities for recycling and reusing materials after they exit the product. Additionally, the End-of-life Vehicle Directive specifies recycling and reusing responsibilities for automotive products while regulating the content of lead, cadmium, mercury, chromium, and polyvinyl chloride to limit their presence in products. This directive also addresses the quality control operation of Lead-Free PCB Assembly.
Purpose
The purpose is to ensure compliance for suppliers converting products to lead-free/hazardous substance-free while ensuring process and product reliability with lead-free solder, hazardous substance compliance, and material compliance.
Process
(1) Manufacturers must document compliance with lead-free/hazardous substance prohibitions for all changes to existing parts as per JESD46-B. Any part changes must comply with lead-free/hazardous substance prohibitions for significant changes.
(2) Discontinuation of existing parts must be notified to the client as per JESD48-A.
(3) Manufacturers must notify customers before producing lead-free/hazardous substance prohibited compliant products and provide a technical roadmap indicating planned changes and implementation schedules. Details on feasibility, recent product developments, life cycle information, and compliant products must be specified.
Compatibility and Testing
A quality approval for a packaged lead-free part shall include various tests such as manual, package, transport, use, solderability test, reliability test, mechanical shock and vibration test, high-temperature storage test, tin whisker growth test, and MSL testing. The comparison between old and new parts should be included in the feasible test.
Parts Confirmation
All parts must have external and internal packaging materials marked with lead-free/hazardous substance prohibition traceability information. The new supplier’s P/N must be included, and the component’s data page should clearly indicate terminal solder composition, temperature values, reflow profile, and humidity sensitivity. If this information is not present, a clear reference should be provided. Standard JEDEC JESD97 should be followed for lead-free/hazardous substance-prohibited product identification and labeling.
Compliance
Verification of “Hazardous Substance Prohibition Compliance” requires the generation and submission of documents confirming the method and result. This verification must be handled as per the guidelines established by industry associations on PCB boards.
