Benefits of Printed Circuit Boards (PCBs) in Electronic Products
- PCBs reduce errors in wiring and assembly, saving time and facilitating maintenance, debugging, and inspection.
- High wiring density, small size, and light weight of PCBs aid in miniaturization, mechanized production, and cost reduction.
Development Trends in PCB Design
In recent years, there has been a shift towards lightweight, thin, small, and high-density interconnections in circuit boards. This trend allows for more micro devices to be loaded onto limited surfaces, driving the development of PCB designs towards high-density, multi-layer configurations with small apertures.
Advancements in Ultra Thin PCB Fabrication
The demand for thinner electronic products has led to significant changes in PCB production processes. Research and development efforts focus on creating ultra thin PCBs with layers less than 0.05 mm thick using multilayer copper foils.
Method for Producing Ultra Thin PCBs
- Select a double-sided copper clad laminate bearing plate with a positioning pattern.
- Stack copper foils, pressing materials, and carrier plates, then hot press to create the required pressing plate.
- Perform edge salvage treatment, cut to size, and drill positioning holes for through holes.
- Conduct circuit fabrication, electroplating, and form conductive circuit patterns.
- Laminate to form insulating and conductive layers, adding processes like laser drilling and electroplating.
- Repeat steps to produce multi-layer inner layer processing boards.
- Trim and separate the multi-layer copper foils.
- Conduct graphic transfer production on the inner layer processing boards.
- Laminate conductive line patterns and add necessary processes for outer layer fabrication.
Conclusion
Advancements in PCB technology continue to drive the development of thinner, more efficient electronic products. The production of ultra thin PCBs requires precise manufacturing processes to meet the demands of modern electronics.
