The most common quality inspections in PCBA processing
1. PCBA Material Testing
Material inspection falls under Incoming Quality Control (IQC). Inspecting raw materials is a crucial step in ensuring processing quality and serves as the foundation for successful SMT assembly.
2. Incoming Material Inspection
Verify that the specifications, models, product details, values, appearance, and dimensions of electronic components and other raw materials align with the BOM provided by the customer. This ensures that the raw materials meet customer requirements. Additionally, integrated circuit testing is performed; parameters such as size, spacing, packaging, and pin configuration all require thorough QC testing.
3. Solder Inspection
Conduct soldering checks on IC pins and raw electronic components to determine whether they have oxidized and assess the solderability of the materials.
**3. PCB Board Inspection**
The quality of the PCB board is crucial for the overall quality of the PCB product; otherwise, issues like cold solder joints, dry joints, and floating components may arise. Therefore, it’s essential to check for deformation, hairline fractures, scratches, line damage, and to ensure that the surface is level.
**4. PCB Tin-Eating Rate Detection**
Moisture impacts the tin-eating rate of the PCB board. If the tin-eating rate is subpar, it can result in poorly shaped spot welds.
**5. Buried Hole Inspection**
The diameter of buried holes is determined by the size of the electronic components. If the holes are too small or too large, the components may either not fit properly or may detach.
**2. Solder Paste Inspection**
The solder paste utilized in PCBA processing is sourced from a reputable supplier. Throughout the usage process, the solder paste follows a “first-in, first-out” standard, meaning the first purchased is the first used. The optimal storage temperature for solder paste is typically between 0°C and 10°C, with a tolerance of ±1°C. Prior to use, the solder paste must be thawed for approximately 4 hours at room temperature and should be properly labeled. Any remaining paste must be disposed of responsibly; second-use paste must be returned to the supplier for processing to prevent environmental contamination. Before application, an automatic stirring device should be used to mix the paste for 5 minutes to eliminate any trapped air and bubbles.
**3. Steel Mesh and Scraper Control**
The standard size for the steel mesh is usually 37cm x 47cm, with a tensile strength of 50-60MPa, typically tested using a tensioner. It is advisable to maintain the storage temperature of the steel mesh at around 25°C. The edges of the mesh are often fitted with rubber borders. High temperatures can lead to brittleness and damage the mesh. The squeegee operates at a 45-degree angle, and it is common for the stencil to wear out after about 20,000 uses. Over time, the thickness of the stencil diminishes, compromising its strength and leading to incomplete solder scraping.
**4. SMT Placement Machine Adjustment and Initial QC**
Adjust the coordinates of the automatic placement machine based on coordinate files such as the BOM, templates, and ECN files provided by the customer to ensure precise measurement and placement. The initial QC inspection involves examining the first sample patch for any missing components, misaligned placements, or inaccuracies. Confirming these details is vital before initiating mass production.
**5. Reflow Soldering Control and Secondary QC**
The reflow oven’s temperature settings should be customized to different profiles based on the PCBA material, such as single-layer, double-layer, or four-layer boards, or aluminum substrates. Additionally, the PCBA processing furnace needs to be checked for clearance, positioning, and component placement. The first sample from the reflow oven is tested by QC to ensure that solder has fully melted, components are intact, and no solder voids exist. Following confirmation, mass production can commence. This testing phase requires an AOI inspection to verify component placement.
**6. Three QC Inspections**
This phase involves a QA inspection conducted by the Quality Control Department. The department must sample the completed PCBA products to ensure they meet quality standards before packaging and delivery.
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1. PCBA Material Testing
Material inspection falls under Incoming Quality Control (IQC). Inspecting raw materials is a crucial step in ensuring processing quality and serves as the foundation for successful SMT assembly.
2. Incoming Material Inspection
Verify that the specifications, models, product details, values, appearance, and dimensions of electronic components and other raw materials align with the BOM provided by the customer. This ensures that the raw materials meet customer requirements. Additionally, integrated circuit testing is performed; parameters such as size, spacing, packaging, and pin configuration all require thorough QC testing.
3. Solder Inspection
Conduct soldering checks on IC pins and raw electronic components to determine whether they have oxidized and assess the solderability of the materials.
**3. PCB Board Inspection**
The quality of the PCB board is crucial for the overall quality of the PCB product; otherwise, issues like cold solder joints, dry joints, and floating components may arise. Therefore, it’s essential to check for deformation, hairline fractures, scratches, line damage, and to ensure that the surface is level.
**4. PCB Tin-Eating Rate Detection**
Moisture impacts the tin-eating rate of the PCB board. If the tin-eating rate is subpar, it can result in poorly shaped spot welds.
**5. Buried Hole Inspection**
The diameter of buried holes is determined by the size of the electronic components. If the holes are too small or too large, the components may either not fit properly or may detach.
**2. Solder Paste Inspection**
The solder paste utilized in PCBA processing is sourced from a reputable supplier. Throughout the usage process, the solder paste follows a “first-in, first-out” standard, meaning the first purchased is the first used. The optimal storage temperature for solder paste is typically between 0°C and 10°C, with a tolerance of ±1°C. Prior to use, the solder paste must be thawed for approximately 4 hours at room temperature and should be properly labeled. Any remaining paste must be disposed of responsibly; second-use paste must be returned to the supplier for processing to prevent environmental contamination. Before application, an automatic stirring device should be used to mix the paste for 5 minutes to eliminate any trapped air and bubbles.
**3. Steel Mesh and Scraper Control**
The standard size for the steel mesh is usually 37cm x 47cm, with a tensile strength of 50-60MPa, typically tested using a tensioner. It is advisable to maintain the storage temperature of the steel mesh at around 25°C. The edges of the mesh are often fitted with rubber borders. High temperatures can lead to brittleness and damage the mesh. The squeegee operates at a 45-degree angle, and it is common for the stencil to wear out after about 20,000 uses. Over time, the thickness of the stencil diminishes, compromising its strength and leading to incomplete solder scraping.
**4. SMT Placement Machine Adjustment and Initial QC**
Adjust the coordinates of the automatic placement machine based on coordinate files such as the BOM, templates, and ECN files provided by the customer to ensure precise measurement and placement. The initial QC inspection involves examining the first sample patch for any missing components, misaligned placements, or inaccuracies. Confirming these details is vital before initiating mass production.
**5. Reflow Soldering Control and Secondary QC**
The reflow oven’s temperature settings should be customized to different profiles based on the PCBA material, such as single-layer, double-layer, or four-layer boards, or aluminum substrates. Additionally, the PCBA processing furnace needs to be checked for clearance, positioning, and component placement. The first sample from the reflow oven is tested by QC to ensure that solder has fully melted, components are intact, and no solder voids exist. Following confirmation, mass production can commence. This testing phase requires an AOI inspection to verify component placement.
**6. Three QC Inspections**
This phase involves a QA inspection conducted by the Quality Control Department. The department must sample the completed PCBA products to ensure they meet quality standards before packaging and delivery.
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Let me know if you need any further adjustments!
