To manufacture PCB circuit boards, the spacing between wires must adhere to electrical safety standards. A wider wire spacing facilitates easier production, while narrower spacing poses greater challenges. Nonetheless, the minimum spacing must always withstand the operational voltage (including working voltage, additional fluctuations, and peak voltages resulting from other factors), with potential issues factored into the design. When wiring density is low, spacing for signal lines can be adjusted accordingly, prioritizing short signal paths and minimizing intervals to mitigate high and low voltage differentials.
The primary factors determining minimum width are the adhesion strength between wires and the insulating substrate, along with the current flowing through them. Copper foil typically ranges from 0.05mm thick with widths of 1-1.5mm. With a current of 2A, a 1.5mm width ensures a temperature increase of no more than 3 ℃. For integrated circuits, wire widths can range from 0.02-0.3mm, preferably wider when feasible. In cases of high current demands, with copper foil thickness at 0.5mm, a 1mm (approximately 40MIL) width sustains 1A, while widths of 1-2.54mm (40-100MIL) suffice for general applications. For high-power equipment and power supply boards, adjust widths based on actual power requirements.
When a board integrates both high-voltage and low-voltage circuits, separate and isolate components accordingly. The isolation distance relates directly to the voltage withstand capacity. Typically, a 2000V withstand voltage requires a 20mm separation, proportionally increasing for higher voltages. For instance, to withstand a 3000V test, maintain a separation of at least 35mm between high and low voltage lines. To prevent creepage, consider introducing slots between high and low voltage areas.
The primary factors determining minimum width are the adhesion strength between wires and the insulating substrate, along with the current flowing through them. Copper foil typically ranges from 0.05mm thick with widths of 1-1.5mm. With a current of 2A, a 1.5mm width ensures a temperature increase of no more than 3 ℃. For integrated circuits, wire widths can range from 0.02-0.3mm, preferably wider when feasible. In cases of high current demands, with copper foil thickness at 0.5mm, a 1mm (approximately 40MIL) width sustains 1A, while widths of 1-2.54mm (40-100MIL) suffice for general applications. For high-power equipment and power supply boards, adjust widths based on actual power requirements.
When a board integrates both high-voltage and low-voltage circuits, separate and isolate components accordingly. The isolation distance relates directly to the voltage withstand capacity. Typically, a 2000V withstand voltage requires a 20mm separation, proportionally increasing for higher voltages. For instance, to withstand a 3000V test, maintain a separation of at least 35mm between high and low voltage lines. To prevent creepage, consider introducing slots between high and low voltage areas.
