The first step is to obtain a PCB. Record the model, parameters, and positions of all essential components on paper, with special attention to the orientation of the diode, three-machine tube, and IC gap. It is recommended to use a digital camera to capture two photos of the component locations.
The second step involves removing all components and cleaning the PAD holes of solder. Use alcohol to clean the PCB before scanning it. While scanning, adjust the pixels to ensure a clear image. Open PHOTOSHOP, scan the silk screen surface in color, save the file, and print it for reference.
The third step requires lightly polishing both the TOP LAYER and BOTTOM LAYER using water-based gauze paper until the copper film shines. Scan both layers separately in color using PHOTOSHOP. Ensure the PCB is placed flat in the scanner for accurate imaging and save the files.
The fourth step involves adjusting the contrast and brightness of the scanned images to improve clarity. Convert the images to black and white format and check for clear lines. Save the images as black and white BMP format files (TOP.BMP and BOT.BMP). Use PHOTOSHOP for any necessary repairs.
In the fifth step, convert the BMP files to PROTEL format and overlay both layers in PROTEL. If the positions of PAD and VIA match, proceed to the next step. Otherwise, repeat the third step.
In the sixth step, convert the TOP layer BMP to TOP.PCB. Trace the lines on the TOP layer, following the reference from the second step. Delete the SILK layer after completing the tracing.
In the seventh step, convert the BOT layer BMP to BOT.PCB. Trace the lines on the BOT layer and delete the SILK layer after tracing.
In the eighth step, import both TOP.PCB and BOT.PCB files in PROTEL and merge them into one image.
In the ninth step, print the TOP LAYER and BOTTOM LAYER on transparent film with a laser printer in a 1:1 ratio. Place the film on the PCB and verify for accuracy. If correct, the process is complete.
For multilayer boards, carefully polish the inner layers and repeat steps three to nine. Naming conventions may vary based on the number of layers, with double-sided boards being simpler compared to multi-layer boards. Great care is required for multi-layer boards to avoid misalignment issues, especially with internal vias.
WellCircuits Limited specializes in high-precision PCB production, including double-sided, multilayer, and specialized boards. Whether it’s HDI, thick copper, backplanes, or rigid-flex combinations, we can meet various customer requirements with our quality products.
The second step involves removing all components and cleaning the PAD holes of solder. Use alcohol to clean the PCB before scanning it. While scanning, adjust the pixels to ensure a clear image. Open PHOTOSHOP, scan the silk screen surface in color, save the file, and print it for reference.
The third step requires lightly polishing both the TOP LAYER and BOTTOM LAYER using water-based gauze paper until the copper film shines. Scan both layers separately in color using PHOTOSHOP. Ensure the PCB is placed flat in the scanner for accurate imaging and save the files.
The fourth step involves adjusting the contrast and brightness of the scanned images to improve clarity. Convert the images to black and white format and check for clear lines. Save the images as black and white BMP format files (TOP.BMP and BOT.BMP). Use PHOTOSHOP for any necessary repairs.
In the fifth step, convert the BMP files to PROTEL format and overlay both layers in PROTEL. If the positions of PAD and VIA match, proceed to the next step. Otherwise, repeat the third step.
In the sixth step, convert the TOP layer BMP to TOP.PCB. Trace the lines on the TOP layer, following the reference from the second step. Delete the SILK layer after completing the tracing.
In the seventh step, convert the BOT layer BMP to BOT.PCB. Trace the lines on the BOT layer and delete the SILK layer after tracing.
In the eighth step, import both TOP.PCB and BOT.PCB files in PROTEL and merge them into one image.
In the ninth step, print the TOP LAYER and BOTTOM LAYER on transparent film with a laser printer in a 1:1 ratio. Place the film on the PCB and verify for accuracy. If correct, the process is complete.
For multilayer boards, carefully polish the inner layers and repeat steps three to nine. Naming conventions may vary based on the number of layers, with double-sided boards being simpler compared to multi-layer boards. Great care is required for multi-layer boards to avoid misalignment issues, especially with internal vias.
WellCircuits Limited specializes in high-precision PCB production, including double-sided, multilayer, and specialized boards. Whether it’s HDI, thick copper, backplanes, or rigid-flex combinations, we can meet various customer requirements with our quality products.
