PCB Production Process
- Step 1: Document the model, parameters, and component positions, paying attention to diode, three-machine tube, and IC gap orientation. Take two photos of the component locations for reference.
- Step 2: Remove components, clean PAD holes, and scan the PCB after cleaning with alcohol. Adjust the pixels for clear imaging, scan the silk screen surface in color, and print for reference.
- Step 3: Lightly polish the TOP and BOTTOM layers with water-based gauze paper until the copper film shines. Scan both layers separately in color using PHOTOSHOP.
- Step 4: Adjust contrast and brightness of scanned images, convert to black and white, and save as BMP format files. Use PHOTOSHOP for any necessary repairs.
- Step 5: Convert BMP files to PROTEL format, overlay both layers, and ensure PAD and VIA positions match before proceeding.
- Step 6: Convert TOP layer BMP to TOP.PCB, trace lines following reference, and delete SILK layer after tracing.
- Step 7: Convert BOT layer BMP to BOT.PCB, trace lines on the BOT layer, and delete SILK layer after tracing.
- Step 8: Import TOP.PCB and BOT.PCB files in PROTEL and merge them into one image.
- Step 9: Print TOP and BOTTOM layers on transparent film with a laser printer in a 1:1 ratio. Verify accuracy by placing the film on the PCB.
For multilayer boards, repeat steps three to nine after carefully polishing inner layers. Naming conventions may vary based on the number of layers, with multi-layer boards requiring extra caution to avoid misalignment issues, especially with internal vias.
WellCircuits Limited – Your PCB Expert
WellCircuits Limited specializes in high-precision PCB production, offering double-sided, multilayer, and specialized boards. From HDI to thick copper, backplanes, and rigid-flex combinations, we meet diverse customer requirements with top-quality products.