In mid-May, Wellcircuits commissioned Huizhou Lier Laboratory, an independent third-party testing institution, to inspect and provide a report on PCBs produced in our factory.
Huizhou Lier Laboratory, a subsidiary of Huizhou Lier Industrial Co., Ltd., has delivered reliable and objective test results for numerous domestic manufacturing brands.
The test was conducted at the PCB Reliability Testing Center of the laboratory over a two-day period. The test focused on thermal stress detection, following the GB/T 4677-2002 test method for printed circuit boards.
The test conditions were as follows:
- Bake the board for 2 hours at 130°C.
- Subject the board to 5 cycles of 10-second tin-bleaching at 288 ± 3°C.
After the thermal stress test, both appearance and section inspections were carried out.
Following the thermal stress test, the sample was inspected for appearance, with no significant blistering, delamination, or other visible damage.
Sectional examination revealed no abnormalities at the PCB hole locations, with the copper remaining intact and no separation in the pore walls.
Huizhou Lier Laboratory issued a comprehensive test report for the PCB samples. The report concluded that after the thermal stress test at 288 ± 3°C, no significant anomalies were observed after 10-second tin drift.
In conclusion:
- The bottom copper of Wellcircuits’ PCB raw material is a standard 0.5OZ (17um) thickness. After drilling, more than 16um of copper thickness remains, with minimal tolerance, meeting Class A standards.
- The surface electrical copper thickness of Wellcircuits’ PCB ranges from 24.49um to 25.76um, with an overall surface copper thickness of 41.37um to 42.17um. This thickness exceeds the 35um (1OZ) industry standard, far surpassing the average.
- The PCB copper thickness of Wellcircuits’ products ranges from 25.27um to 28.78um, with uniform adhesion, which exceeds the international standard of 18-22um as specified in IPC-6012.
If you have any questions about PCBs or PCBA, please contact us at info@wellcircuits.com.
