Methods for Disassembling an Integrated Circuit

• Tin Suction Device: A common professional method involves using a tin suction device. Simply place the heated soldering iron tip on the pins of the integrated block to melt the solder joints. The melted solder can then be easily sucked into the tin absorber, allowing for the easy removal of the blocks.
• Internal Thermal Desolder Removal Method: This method involves squeezing a rubber ball to suck melted solder into a collection tube. Place the tin tip on the solder collection tube at the unsoldering point, release the rubber ball to suck the solder, and then transfer it into the collecting cylinder.
• Medical Hollow Core Needle Disassembly Method: Utilize 8-12-gauge hollow core needles typically used for medical purposes. These needles should have an inner diameter sufficient to cover the pins of the integrated block. Melt the solder on the pins with a soldering iron, cover the pins with the needles, rotate the pin to solidify the solder, and then pull out the pin to separate it from the board. Repeat for all pins to remove the integrated block.