1. The benefits of alternative PCBA MCM technologies include cost reduction, size reduction, weight reduction, strong environmental adaptability, and fewer interfaces needed to enhance performance.
2. The advantages of various PCBA MCM technologies can be tailored to different markets.
3. In scenarios where PCBA MCM technology is expensive, COB offers the most cost-effective solution.
4. Thus, COB technology is preferable when cost is a primary concern.
5. For instance, most handheld calculators in consumer electronics utilize COB technology.
6. Conversely, despite the higher cost of implementing PCBA MCM, it can reduce overall system costs due to the decreased PCB size and assembly costs.
7. In aerospace and military applications, the size and weight reduction capabilities of PCBA MCM are crucial, making it a common choice for spacecraft.
8. Currently, notebook computer manufacturers have started adopting PCBA MCM-L technology.
9. Ceramic hybrid circuit packaging is extensively used in harsh environments, such as automotive electronics.
10. Ceramic packages are selected for applications requiring isolation from the external environment.
1. In addition to notebook computers, high-performance telecommunications, data processing, network equipment, and other devices requiring high speed and multiple interfaces also utilize PCBA MCM technology. High-end computers have been using PCBA MCM-C for years to enhance their operating speed.
2. With continuous performance improvements in low-end systems, particularly the rise in multi-processor applications, PCBA MCM is poised to capture a significant share of the electronic packaging market. Currently, the most commercial applications of PCBA MCM remain in portable electronic products. Conversely, some high-performance single-chip packages might shift to PCBA MCM due to limitations in lead-out pins. This transition improves reliability by reducing interconnections in the second-level package.
3. Although addressing the KGD (Known Good Die) issue is costly and challenging, PCBA MCM maintains substantial market potential. For low-end products, the driving force is size and cost reduction, while for high-end products, it focuses on size reduction and performance enhancement.
4. In 2002, the European PCBA MCM market experienced significant growth, reaching approximately 4 billion USD, driven primarily by the need to reduce electronic product sizes. By 2007, the market is expected to expand to 10 billion USD, with cost reduction as the main growth driver.
5. Driven by market demands and advancements in design, packaging technology, materials, and processes, the cost of PCBA MCM has started to decrease. Internationally, PCBA MCMs employing various standard package outlines, such as PDIP, QFP, and BGA, are now available. Different PCBA MCM types have adopted diverse single-chip packaging technologies, including gold wire bonding, chip bumping, and FC technology. The widespread use of standard packaging outlines and processes has significantly reduced packaging costs.
6. The thickness of sputtered multilayer aluminum interconnection layers typically ranges from 1 to 3 microns. Power and ground connections to the substrate require specific impedance and reduced coupling. The dielectric layer, made of 3 to 7 microns thick BCB polymer, provides stability at THz frequencies. Besides gallium arsenide chips and silicon application-specific integrated circuits, BCB is widely used in wafer-level chip size packaging (WLCSP).
7. The substrate and two chips often come from different manufacturers. Including gold bumps, the internal wiring exceeds 350 lines. Due to the use of world-class chips, some PCBA MCMs from PCB factories boast top-tier quality. They can pass reliability assessments, including 1000 temperature cycles from -40 to 125°C, with a packaging and testing pass rate of up to 99% at 122°C. The package shape is mainly standard PDIP, making the package cost comparable to ordinary single-chip ICs. Equipment investment and production capacity are similar to single-chip ICs.
8. To ensure the packaging quality of PCBA MCM, many manufacturers have adopted various new packaging processes. For example, designing lead frames with special structures addresses thermal endurance for large chips and packages. Multiple considerations exist for PCBA MCM packaging, and selecting appropriate materials can enable the BGAPCBA MCM-L to endure thermal shock levels comparable to single-chip PQFPs.
9. To reduce PCBA MCM packaging costs, selecting the right packaging method is crucial. Commonly used packaging methods and characteristics for mass production include:
– Assembly after plastic packaging: Low cost and easy assembly
– Overall plastic package: Suitable for mass production
– COB package: Bare chip and surface mount component package
– Metal package: Resistant to harsh environments, but high cost
– Ceramic package: High-performance package
10. The overall plastic packaging method adopted by PCBA MCM is well-suited for mass production manufacturers.
2. The advantages of various PCBA MCM technologies can be tailored to different markets.
3. In scenarios where PCBA MCM technology is expensive, COB offers the most cost-effective solution.
4. Thus, COB technology is preferable when cost is a primary concern.
5. For instance, most handheld calculators in consumer electronics utilize COB technology.
6. Conversely, despite the higher cost of implementing PCBA MCM, it can reduce overall system costs due to the decreased PCB size and assembly costs.
7. In aerospace and military applications, the size and weight reduction capabilities of PCBA MCM are crucial, making it a common choice for spacecraft.
8. Currently, notebook computer manufacturers have started adopting PCBA MCM-L technology.
9. Ceramic hybrid circuit packaging is extensively used in harsh environments, such as automotive electronics.
10. Ceramic packages are selected for applications requiring isolation from the external environment.
1. In addition to notebook computers, high-performance telecommunications, data processing, network equipment, and other devices requiring high speed and multiple interfaces also utilize PCBA MCM technology. High-end computers have been using PCBA MCM-C for years to enhance their operating speed.
2. With continuous performance improvements in low-end systems, particularly the rise in multi-processor applications, PCBA MCM is poised to capture a significant share of the electronic packaging market. Currently, the most commercial applications of PCBA MCM remain in portable electronic products. Conversely, some high-performance single-chip packages might shift to PCBA MCM due to limitations in lead-out pins. This transition improves reliability by reducing interconnections in the second-level package.
3. Although addressing the KGD (Known Good Die) issue is costly and challenging, PCBA MCM maintains substantial market potential. For low-end products, the driving force is size and cost reduction, while for high-end products, it focuses on size reduction and performance enhancement.
4. In 2002, the European PCBA MCM market experienced significant growth, reaching approximately 4 billion USD, driven primarily by the need to reduce electronic product sizes. By 2007, the market is expected to expand to 10 billion USD, with cost reduction as the main growth driver.
5. Driven by market demands and advancements in design, packaging technology, materials, and processes, the cost of PCBA MCM has started to decrease. Internationally, PCBA MCMs employing various standard package outlines, such as PDIP, QFP, and BGA, are now available. Different PCBA MCM types have adopted diverse single-chip packaging technologies, including gold wire bonding, chip bumping, and FC technology. The widespread use of standard packaging outlines and processes has significantly reduced packaging costs.
6. The thickness of sputtered multilayer aluminum interconnection layers typically ranges from 1 to 3 microns. Power and ground connections to the substrate require specific impedance and reduced coupling. The dielectric layer, made of 3 to 7 microns thick BCB polymer, provides stability at THz frequencies. Besides gallium arsenide chips and silicon application-specific integrated circuits, BCB is widely used in wafer-level chip size packaging (WLCSP).
7. The substrate and two chips often come from different manufacturers. Including gold bumps, the internal wiring exceeds 350 lines. Due to the use of world-class chips, some PCBA MCMs from PCB factories boast top-tier quality. They can pass reliability assessments, including 1000 temperature cycles from -40 to 125°C, with a packaging and testing pass rate of up to 99% at 122°C. The package shape is mainly standard PDIP, making the package cost comparable to ordinary single-chip ICs. Equipment investment and production capacity are similar to single-chip ICs.
8. To ensure the packaging quality of PCBA MCM, many manufacturers have adopted various new packaging processes. For example, designing lead frames with special structures addresses thermal endurance for large chips and packages. Multiple considerations exist for PCBA MCM packaging, and selecting appropriate materials can enable the BGAPCBA MCM-L to endure thermal shock levels comparable to single-chip PQFPs.
9. To reduce PCBA MCM packaging costs, selecting the right packaging method is crucial. Commonly used packaging methods and characteristics for mass production include:
– Assembly after plastic packaging: Low cost and easy assembly
– Overall plastic package: Suitable for mass production
– COB package: Bare chip and surface mount component package
– Metal package: Resistant to harsh environments, but high cost
– Ceramic package: High-performance package
10. The overall plastic packaging method adopted by PCBA MCM is well-suited for mass production manufacturers.
