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- Plating Burn:
Possible causes:
- Insufficient boric acid
- Low concentration of metal salts
- Low working temperature
- High current density
- High pH or insufficient stirring
- Low Deposition Rate:
Possible causes:
- Low pH or low current density
- Inadequate activation and deoxidization of copper coating
- Current interruption or low temperature
- Brittle Coating and Poor Solderability:
Indications of organic or heavy metal contamination
- Excessive additives leading to organic pollution
- Electrolysis to remove heavy metal impurities
- Dark and Uneven Coating:
Metal contamination from copper plating
- Use of corrugated steel plate as cathode for removal of contamination
- Coating Blistering or Peeling:
Possible causes:
- Poor pretreatment
- Organic impurity pollution
- High current density or low temperature
- Anode Passivation:
Insufficient anode activator or small anode area - Hemp Pit (Pinhole):
Caused by organic pollution
- Large pits indicate oil contamination
- Small pits, or pinholes, caused by poor pretreatment, metal impurities, low boric acid content
- Rough (Burr) Coating:
Caused by dirty solution
- pH control
- High current density or impure anode slime causing roughness
