a) Hemp Pit: Organic pollution leads to hemp pits, potentially due to oil contamination. Inadequate agitation fails to dislodge air bubbles, causing pits. A wetting agent can mitigate its impact. Small pits, known as pinholes, may result from poor pretreatment, low metal quality, insufficient boric acid content, or low bath temperature. Process control and the addition of anti-pinhole agents are crucial.

b) Roughness and Burrs: Dirty solution causes roughness, which can be rectified by thorough filtration. Excessive current density and impure water can introduce impurities, resulting in roughness and burrs.

c) Low Adhesion: Inadequately deoxidized copper coating leads to poor adhesion between copper and nickel. Interruptions in the current or low temperature may also cause peeling of the nickel coating.

d) Coating Brittleness And Poor Weldability: Organic or heavy metal pollution causes coating brittleness. Adequate treatment with activated carbon is necessary. Insufficient additives, entrained organics, and electroplating resists potentially contribute to organic pollution.

e) Unstable Coating Color: Metal pollution, particularly copper solution, may lead to uneven coating color. Minimizing the copper solution on the hanger is crucial. A corrugated steel cathode and the removal of metal contamination in the tank are recommended.

f) Coating Burn: Causes of coating burn include insufficient boric acid, low metal salt concentration, low working temperature, high current density, high pH, or inadequate stirring.

g) Low Deposition Rate: A low P value or low current density results in a low deposition rate.

h) Blistering or Peeling of the Coating: Poor pre-plating treatment, prolonged interruption time, organic impurity pollution, excessive current density, inadequate temperature, high or low pH may cause blistering or peeling.

i) Anode Passivation: Insufficient anode activator, small anode area, or excessive current density may lead to anode passivation.