- High-Speed Digital (HSD)
TU-768
High-Tg and High Thermal Reliability Laminate and Prepreg
Core: TU-768; Prepreg: TU-768P
TU-768 and TU-768P laminates and prepregs are manufactured from high-quality woven E-glass impregnated with an epoxy resin system. This construction provides UV-blocking properties and ensures compatibility with automated optical inspection (AOI) processes. These materials are ideal for applications requiring high thermal stability and resistance to severe thermal cycling or extensive assembly operations. TU-768 laminates offer excellent coefficient of thermal expansion (CTE), superior chemical and thermal resistance, and anti-CAF (Conductive Anodic Filament) properties.
Main Applications
- Consumer Electronics
- Servers and Workstations
- Automotive
Key Features
- Lead-free process compatibility
- Excellent coefficient of thermal expansion
- Anti-CAF property
- Superior chemical and thermal resistance
- Fluorescence for AOI
- Moisture resistance
| Property | Typical Values |
|---|---|
| Tg (DMA) | 190°C |
| Tg (DSC) | 180°C |
| Tg (TMA) | 170°C |
| Td (TGA) | 340°C |
| CTE z-axis (50 to 260°C) | 2.7% |
| T-260/T-288 | >60 min / >15 min |
| Permittivity @1GHz (RC 50%) | 4.3 |
| Loss Tangent @1GHz (RC 50%) | 0.018 |
Industry Approvals
- IPC-4101E Type Designation: /98, /99, /101, /126
- IPC-4101E/126 Validation Services QPL Certified
- UL Designation – ANSI Grade: FR-4.0
- UL File Number: E189572
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 130°C
Standard Availability
- Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
- Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double-sided and H to 2oz (MLS)
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080, 2113, 2116, 1506, and 7628, among others
Document Downloads
If you have any questions regarding PCBs or PCBA, please contact me at info@wellcircuits.com.
