“`html
- High Speed Digital (HSD)
TU-872 LK
Low Dk/Df and High Thermal Reliability Material
Core: TU-872 LK; Prepreg: TU-87P LK
TU-872 LK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 LK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 LK laminates also exhibit excellent CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.
Main Applications
- Backpanel, High performance computing
- Line cards, Storage
- Servers, Telecom, Base station
- Office Routers
Key Features
- Excellent electrical properties
- Dielectric constant less than 4.0
- Dissipation factor less than 0.010
- Stable and flat Dk/Df performance
- Compatible with most FR-4 processes
- Lead free process compatible
- Improved z-axis thermal expansion
- Anti-CAF capability
- Superior dimensional stability, thickness uniformity and flatness
- Excellent through-hole and soldering reliability
| Property | Typical Values |
| Tg (DMA) | 220°C |
| Tg (DSC) | 200°C |
| Tg (TMA) | 190°C |
| Td (TGA) | 340°C |
| CTE z-axis (50 to 260 °C) | 2.5% |
| T-260/ T288 | 60 min/ 20 min |
| Permittivity (RC 50%) @10GHz | 3.8 |
| Loss Tangent (RC 50%) @10GHz | 0.009 |
Industry Approvals
- IPC-4101E Type Designation : /29, /99, /101, /126
- IPC-4101E/126 Validation Services QPL Certified
- UL designation – ANSI Grade: FR-4.0
- UL file number: E189572
- Flammability rating: 94V-0
- Maximum Operating Temperature: 130°C
Standard Availability
- Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
- Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request
Document Downloads For Public
- TU-872 LK_Datasheet.pdf
TU-872 SLK
Low Dk/Df and High Thermal Reliability Material
Core: TU-872 SLK; Prepreg: TU-87P SLK
TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 SLK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.
Main Applications
- Radio Frequency
- Backpanel, High performance computing
- Line cards, Storage
- Servers, Telecom, Base station
- Office Routers
Key Features
- Excellent electrical properties
- Dielectric constant less than 4.0
- Dissipation factor less than 0.010
- Stable and flat Dk/Df performance
- Compatible with modified FR-4 processes
- Excellent moisture resistance and Lead Free reflow process compatible
- Improved Z-axis thermal expansion
- Anti-CAF capability
- Superior dimensional stability, thickness uniformity and flatness
- Excellent through-hole and soldering reliability
| Property | Typical Values |
| Tg (DMA) | 220°C |
| Tg (DSC) | 200°C |
| Tg (TMA) | 190°C |
| Td (TGA) | 340°C |
| CTE z-axis (50 to 260 °C) | 2.3% |
| T-260/ T288 | 60 min/ 20 min |
| Permittivity (RC 50%) @10GHz | 3.8 |
| Loss Tangent (RC 50%) @10GHz | 0.009 |
Industry Approvals
- IPC-4101E Type Designation : /29, /99, /101, /126
- IPC-4101E/126 Validation Services QPL Certified
- UL Designation – ANSI Grade: FR-4.0
- UL File Number: E189572
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 130°C
Standard Availability
- Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
- Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request
Document Downloads For Public
- TU-872 SLK_Datasheet.pdf
TU-872 SLK Sp
Low Dk/Df and High Thermal Reliability Material
Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp
Main Applications
- Radio Frequency
- Backpanel, High performance computing
- Line cards, Storage
- Servers, Telecom, Base station
- Office Routers
Key Features
- Excellent electrical properties
- Dielectric constant less than 3.5
- Dissipation factor less than 0.010
- Excellent, stable and flat Dk/Df performance
- Compatible with most FR-4 processes
- Lead free process compatible
- Improved z-axis thermal expansion
- Anti-CAF capability
- Superior dimensional stability, thickness uniformity and flatness
- Excellent through-hole and soldering reliability
| Property | Typical Values |
| Tg (DMA) | 220°C |
| Tg (DSC) | 200°C |
| Tg (TMA) | 190°C |
| Td (TGA) | 340°C |
| CTE z-axis (50 to 260 °C) | 2.7% |
| T-260/ T288 | 60 min/ 20 min |
| Permittivity (RC 50%) @10GHz | 3.5 |
| Loss Tangent (RC 50%) @10GHz | 0.008 |
Industry Approvals
- IPC-4101 Type Designation : /29, /98, /99, /101, /126
- IPC-4101E/126 Validation Services QPL Certified
- UL Designation – ANSI Grade: FR-4.0
- UL File Number: E189572
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 130°C
Standard Availability
- Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
- Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080 and 2116
Document Downloads For Public
- TU-872 SLK Sp_Datasheet.pdf
if your have any questions about pcb and pcba,please connect me info@wellcircuits.com
