1. Compliance with IPC4101ClassB/L for CCL Tolerance Requirements
– Benefit: Precise control of dielectric layer thickness reduces electrical performance deviation, leading to consistent output/performance.
– Risk: Inadequate electrical performance and significant variation in component output within the same batch.
2. Adherence to IPC-SM-840ClassT for Solder Mask Material Definition
– Benefit: Ensuring “excellent” ink safety and compliance with UL standards, preventing adhesion and hardness issues.
– Risk: Poor-quality inks causing adhesion, flux resistance, and hardness problems, leading to solder mask detachment and potential copper circuit corrosion.
3. Strict Tolerances for Shapes, Holes, and Mechanical Features
– Benefit: Tight control of tolerances improves product dimensional quality, enhancing fit, form, and function.
– Risk: Alignment and mating problems during assembly, as well as mounting difficulties due to increased dimensional deviations.
4. Required Thickness of Solder Mask
– Benefit: Improved insulation properties and resistance to mechanical shock, reducing the risk of detachment and copper circuit corrosion.
– Risk: Thinner solder mask leading to adhesion, flux resistance, and hardness problems, potentially causing short circuits and accidental electrical continuity/arcing.
5. Appearance and Repair Requirements Definition
– Benefit: Ensuring a safe and carefully manufactured product.
– Risk: Potential surface damage impacting assembly and hidden issues impacting actual use.
6. Plug Hole Depth Requirements
– Benefit: High-quality plug holes reduce assembly failure risk.
– Risk: Residual chemical deposits and tin beads in incomplete plug holes causing solderability issues and short circuits.
7. Specification of Peelable Blue Glue Brand and Model
– Benefit: Avoiding the use of inferior or cheap brands of peelable blue glue.
– Risk: Poor quality or cheap peelables causing assembly issues and rendering the peelables ineffective.
8. Specific Approval and Ordering Procedures for Each Purchase Order
– Benefit: Ensuring confirmation of all specifications in the purchase order process.
– Risk: Uncovered specification deviations discovered only during assembly or final product stages, leading to setbacks.
9. Rejection of Scrapped Units
– Benefit: Enhancing efficiency by avoiding the use of partial assemblies.
– Risk: Special assembly procedures for defective kits, potential assembly of known bad boards, and waste of parts and time if scrapped units are not clearly marked or isolated.