1. The SMOBC process and plugging method for pattern electroplating and lead and tin stripping:
The SMOBC process for pattern electroplating followed by lead and tin stripping is similar to the pattern electroplating process, with changes only occurring after etching.
Double-sided copper clad board → follow the pattern electroplating process to the etching process → lead and tin removal → inspection → cleaning → solder mask patterning → nickel plating and gold plating plugging → apply tape for plugging → hot air leveling → cleaning → screen print symbols → shape processing → wash and dry → final product inspection → packaging → final product.
2. The main process flow for the plugging method is as follows:
Double-sided foil-clad board → drilling → chemical copper plating → copper plating on entire PCB board → hole blocking → screen print imaging (positive image) → etching → remove screen print material and block material → cleaning → solder mask patterning → nickel plating, gold-plating plugging → tape plugging → hot air leveling → subsequent procedures follow the same steps until reaching the final product.
The process steps of this method are relatively straightforward, with the key focus on plugging the holes and washing the ink used for plugging.
In the hole plugging process, if special masking dry film is used to cover the holes instead of hole plugging ink and screen print imaging, and then exposed to create a positive image, this is known as the masking hole process. This process eliminates the issue of cleaning the ink in the holes but requires a higher level of precision in applying the masking dry film.
The SMOBC process for pattern electroplating followed by lead and tin stripping is similar to the pattern electroplating process, with changes only occurring after etching.
Double-sided copper clad board → follow the pattern electroplating process to the etching process → lead and tin removal → inspection → cleaning → solder mask patterning → nickel plating and gold plating plugging → apply tape for plugging → hot air leveling → cleaning → screen print symbols → shape processing → wash and dry → final product inspection → packaging → final product.
2. The main process flow for the plugging method is as follows:
Double-sided foil-clad board → drilling → chemical copper plating → copper plating on entire PCB board → hole blocking → screen print imaging (positive image) → etching → remove screen print material and block material → cleaning → solder mask patterning → nickel plating, gold-plating plugging → tape plugging → hot air leveling → subsequent procedures follow the same steps until reaching the final product.
The process steps of this method are relatively straightforward, with the key focus on plugging the holes and washing the ink used for plugging.
In the hole plugging process, if special masking dry film is used to cover the holes instead of hole plugging ink and screen print imaging, and then exposed to create a positive image, this is known as the masking hole process. This process eliminates the issue of cleaning the ink in the holes but requires a higher level of precision in applying the masking dry film.
