1. Introduction to the production method of PCB board
1.1 Method 1:
(1) Cut the copper clad board to the size required for the circuit diagram.
(2) Place wax paper on a steel plate, use a pen to draw the circuit diagram at a 1:1 ratio on the wax paper, and cut out the circuit diagram according to the size of the circuit board. Position the cut wax paper on the copper clad board. Prepare a suitable printing material by mixing a small amount of paint with talc powder. Dip a brush in the printing material and apply it evenly onto the wax paper. Repeat this process several times to print the circuit onto the board. This stencil is reusable and suitable for small batches.
(3) Prepare a corrosion solution using 1 gram of potassium chlorate and 40 ml of 15% hydrochloric acid. Apply the solution to the areas of the circuit board that require etching.
(4) Rinse the etched board thoroughly with water. Clean off any remaining paint using a banana water solution, followed by additional rinsing to remove any residual corrosive liquid. Apply a coat of rosin solution, allow it to dry, and then proceed with drilling the necessary holes.
1.2 Method 2:
(1) Start by creating the printing plate design, representing pads as dots in the figure. Connections can be depicted with single lines, ensuring accurate placement and sizing.
(2) Cut the printing plate to match the required dimensions and clean the copper foil surface thoroughly.
(3) Optionally, use carbon paper to transfer the diagram onto the board. This step may be omitted for simpler circuits or experienced makers.
(4) Apply standard pre-cut pads with varying inner and outer diameters based on component specifications. Adjust tape widths for different current requirements. Opt for paper-based materials (black) over plastic-based (red), with common tape specifications such as 0.3, 0.9, 1.8, 2.3, and 3.7 mm—all measurements in millimeters.
(5) Secure the components by tapping them gently with a soft hammer, ensuring firm adhesion to the copper foil, particularly at joint corners. In cold weather, warm the surface with a heater to enhance adhesion.
(6) Immerse the board in ferric chloride for etching. Ensure the liquid temperature does not exceed 40 degrees Celsius. Rinse promptly after etching, paying attention to areas with delicate lines.
(7) Punch holes, polish the copper foil surface with fine sandpaper, apply a rosin alcohol solution, and allow it to dry thoroughly to complete the production. This method yields a printed board comparable in quality to commercially made ones. Using 0.3 mm tape facilitates reduced jumper wires between IC pins, saving time and effort.
1.3 Method 3:
Create a protective paint solution by dissolving one part lacquer sheet (shellac, available at chemical raw material stores) in three parts anhydrous alcohol. Stir until a consistent color is achieved. Apply this mixture to the polished copper-clad plate using a duckbill pen or similar instrument. Adjust the stroke thickness using the pen’s nut and a ruler. Use a triangular ruler for straight lines, ensuring smooth, even strokes without jagged edges. If lines are too thin, add varnish for clarity; if too thick, dilute with anhydrous alcohol. Mistakes can be corrected by gently wiping with a small cotton swab dipped in anhydrous alcohol and reapplying the solution as needed. After drawing the circuit, etch using ferric chloride. Post-etching, remove the protective paint using anhydrous alcohol on a cotton ball. Store excess protective paint in a sealed container to prevent evaporation, adding anhydrous alcohol as necessary.
1.4 Method 4:
Begin by applying an instant sticker to the copper foil of the copper-clad plate. Draw the circuit design on the sticker and carve out the required circuit using a carving knife. Etch the plate with ferric chloride or current electrolysis for optimal results, adjusting the corrosion temperature to around 55 degrees Celsius for faster results. Rinse the etched board thoroughly, remove the sticker, punch holes as needed, clean the board, and apply a rosin alcohol solution for further processing.
1.5 Method 5:
(1) Arrange component positions based on circuit schematic and printed board area, ensuring efficient component density and rational placement of fastener rivet standoffs. Place components logically, prioritizing the main components before detailing connections to minimize wiring complexity.
(2) Avoid sharp turns in wire connections; use gradual curves instead of right angles at intersections. When necessary, route wires on the reverse side of the board or use insulated wires for longer detours. Maintain adequate distance between input and output sections to prevent interference.
1.6 Method 6:
Introduce the “sub-printing” method for PCB fabrication:
(1) Print or hand-draw the circuit diagram on 80gsm copy paper at a 1:1 scale. Ensure the paper is flat.
(2) Replace fax machine paper with hot melt plastic film. Copy the circuit diagram onto the plastic film using the fax machine’s copy function.
(3) Use double-sided tape to secure the plastic film flatly onto the copper-clad plate, ensuring no wrinkles and avoiding tape over the melted part to maintain production quality.
(4) Apply paint evenly on the plastic film using a paintbrush, ensuring single-direction strokes to prevent film wrinkling and overlapping on the copper plate lines. After completing the circuit diagram, carefully remove the plastic film. Dry thoroughly before etching. For mass production, use a wooden frame to align multiple boards under a silk screen, applying paint in one direction with consistent pressure. Correct errors with paint and bamboo tools, adjusting brush pressure for optimal results.
2. Introduction to PCB Board Process in PROTEL:
Newcomers often find Protel software user-friendly but struggle with understanding non-software concepts crucial to PCB design. Understanding the modern PCB manufacturing flow—from single-sided to multi-layer boards—is essential for effective design. Key steps include cutting, screen printing, etching, material removal, drilling, marking, flux application, and finalizing products. Differentiating from virtual layers in other software, Protel layers directly influence the physical PCB, accommodating dense electronic components and wiring needs. Multi-layer boards support complex circuits with specialized power and signal layers, interconnected by vias. Silkscreen layers display essential component details, optimizing assembly and maintenance. Integrating SMD components requires surface-specific design and careful attention to pad placement. External plane and fill areas aid circuit performance, particularly in shielding and high-current environments. Customizing pad types ensures structural integrity and thermal management. Solder masks protect against unwanted tin adhesion, crucial for reliable soldering. Optimizing via usage minimizes signal interference and supports high-current paths. Understanding these principles is fundamental for mastering Protel and achieving efficient PCB designs.
1.1 Method 1:
(1) Cut the copper clad board to the size required for the circuit diagram.
(2) Place wax paper on a steel plate, use a pen to draw the circuit diagram at a 1:1 ratio on the wax paper, and cut out the circuit diagram according to the size of the circuit board. Position the cut wax paper on the copper clad board. Prepare a suitable printing material by mixing a small amount of paint with talc powder. Dip a brush in the printing material and apply it evenly onto the wax paper. Repeat this process several times to print the circuit onto the board. This stencil is reusable and suitable for small batches.
(3) Prepare a corrosion solution using 1 gram of potassium chlorate and 40 ml of 15% hydrochloric acid. Apply the solution to the areas of the circuit board that require etching.
(4) Rinse the etched board thoroughly with water. Clean off any remaining paint using a banana water solution, followed by additional rinsing to remove any residual corrosive liquid. Apply a coat of rosin solution, allow it to dry, and then proceed with drilling the necessary holes.
1.2 Method 2:
(1) Start by creating the printing plate design, representing pads as dots in the figure. Connections can be depicted with single lines, ensuring accurate placement and sizing.
(2) Cut the printing plate to match the required dimensions and clean the copper foil surface thoroughly.
(3) Optionally, use carbon paper to transfer the diagram onto the board. This step may be omitted for simpler circuits or experienced makers.
(4) Apply standard pre-cut pads with varying inner and outer diameters based on component specifications. Adjust tape widths for different current requirements. Opt for paper-based materials (black) over plastic-based (red), with common tape specifications such as 0.3, 0.9, 1.8, 2.3, and 3.7 mm—all measurements in millimeters.
(5) Secure the components by tapping them gently with a soft hammer, ensuring firm adhesion to the copper foil, particularly at joint corners. In cold weather, warm the surface with a heater to enhance adhesion.
(6) Immerse the board in ferric chloride for etching. Ensure the liquid temperature does not exceed 40 degrees Celsius. Rinse promptly after etching, paying attention to areas with delicate lines.
(7) Punch holes, polish the copper foil surface with fine sandpaper, apply a rosin alcohol solution, and allow it to dry thoroughly to complete the production. This method yields a printed board comparable in quality to commercially made ones. Using 0.3 mm tape facilitates reduced jumper wires between IC pins, saving time and effort.
1.3 Method 3:
Create a protective paint solution by dissolving one part lacquer sheet (shellac, available at chemical raw material stores) in three parts anhydrous alcohol. Stir until a consistent color is achieved. Apply this mixture to the polished copper-clad plate using a duckbill pen or similar instrument. Adjust the stroke thickness using the pen’s nut and a ruler. Use a triangular ruler for straight lines, ensuring smooth, even strokes without jagged edges. If lines are too thin, add varnish for clarity; if too thick, dilute with anhydrous alcohol. Mistakes can be corrected by gently wiping with a small cotton swab dipped in anhydrous alcohol and reapplying the solution as needed. After drawing the circuit, etch using ferric chloride. Post-etching, remove the protective paint using anhydrous alcohol on a cotton ball. Store excess protective paint in a sealed container to prevent evaporation, adding anhydrous alcohol as necessary.
1.4 Method 4:
Begin by applying an instant sticker to the copper foil of the copper-clad plate. Draw the circuit design on the sticker and carve out the required circuit using a carving knife. Etch the plate with ferric chloride or current electrolysis for optimal results, adjusting the corrosion temperature to around 55 degrees Celsius for faster results. Rinse the etched board thoroughly, remove the sticker, punch holes as needed, clean the board, and apply a rosin alcohol solution for further processing.
1.5 Method 5:
(1) Arrange component positions based on circuit schematic and printed board area, ensuring efficient component density and rational placement of fastener rivet standoffs. Place components logically, prioritizing the main components before detailing connections to minimize wiring complexity.
(2) Avoid sharp turns in wire connections; use gradual curves instead of right angles at intersections. When necessary, route wires on the reverse side of the board or use insulated wires for longer detours. Maintain adequate distance between input and output sections to prevent interference.
1.6 Method 6:
Introduce the “sub-printing” method for PCB fabrication:
(1) Print or hand-draw the circuit diagram on 80gsm copy paper at a 1:1 scale. Ensure the paper is flat.
(2) Replace fax machine paper with hot melt plastic film. Copy the circuit diagram onto the plastic film using the fax machine’s copy function.
(3) Use double-sided tape to secure the plastic film flatly onto the copper-clad plate, ensuring no wrinkles and avoiding tape over the melted part to maintain production quality.
(4) Apply paint evenly on the plastic film using a paintbrush, ensuring single-direction strokes to prevent film wrinkling and overlapping on the copper plate lines. After completing the circuit diagram, carefully remove the plastic film. Dry thoroughly before etching. For mass production, use a wooden frame to align multiple boards under a silk screen, applying paint in one direction with consistent pressure. Correct errors with paint and bamboo tools, adjusting brush pressure for optimal results.
2. Introduction to PCB Board Process in PROTEL:
Newcomers often find Protel software user-friendly but struggle with understanding non-software concepts crucial to PCB design. Understanding the modern PCB manufacturing flow—from single-sided to multi-layer boards—is essential for effective design. Key steps include cutting, screen printing, etching, material removal, drilling, marking, flux application, and finalizing products. Differentiating from virtual layers in other software, Protel layers directly influence the physical PCB, accommodating dense electronic components and wiring needs. Multi-layer boards support complex circuits with specialized power and signal layers, interconnected by vias. Silkscreen layers display essential component details, optimizing assembly and maintenance. Integrating SMD components requires surface-specific design and careful attention to pad placement. External plane and fill areas aid circuit performance, particularly in shielding and high-current environments. Customizing pad types ensures structural integrity and thermal management. Solder masks protect against unwanted tin adhesion, crucial for reliable soldering. Optimizing via usage minimizes signal interference and supports high-current paths. Understanding these principles is fundamental for mastering Protel and achieving efficient PCB designs.
