1. Printed circuit board manufacturing technology is a complex and highly comprehensive processing method.

2. PCBA patch processing plants highlight that, particularly during the wet processing phase, a substantial amount of water is required, resulting in the discharge of various heavy metal and organic wastewaters.

3. The composition of these wastewaters is complex, making treatment challenging.

4. Based on a utilization rate of printed circuit board copper foil of 30% to 40%, the copper content in the waste liquid and wastewater is significant.

5. For example, in the production of 10,000 square meters of double-sided panels (with each side’s copper foil thickness at 35 microns), the copper content in the waste liquid and wastewater can reach approximately 4,500 kg, along with various other heavy metals and precious metals.

6. If these metals in the waste liquid and wastewater are discharged untreated, it not only results in resource wastage but also poses a severe environmental threat.

7. Consequently, wastewater treatment and the recovery of copper and other metals during the printed board production process are of great importance, forming an indispensable part of the manufacturing cycle.

8. It is widely recognized that a significant portion of the wastewater generated during printed circuit board production is copper, with smaller quantities of lead, tin, gold, silver, fluorine, ammonia, organics, and organic complexes.