1. The main reason for the reserved process edge in PCB board production is to prevent collision during the SMT mounting process. This is because the SMT mounter track is used to clamp the circuit board and flow through the mounter.
2. Components that are too close to the track edge may be absorbed by the SMT mounter nozzle and mounted on the circuit board, resulting in collision and production interruption.
3. In order to avoid this issue, process edges are generally added during PCB assembly production to accommodate subsequent patches and plug-ins.
4. What are the advantages of reserving process edges for PCB production?
5. By reserving process edges, PCB manufacturers can prevent potential collisions during the SMT mounting process, ensuring smooth production and high-quality assembly.
6. Additionally, the reserved process edges provide flexibility for future modifications or adjustments to the PCB layout, allowing for easier rework and troubleshooting.
7. Furthermore, the process edges can serve as a visual reference for PCB designers and as a protective buffer for delicate components, reducing the risk of damage during the assembly process.
8. Overall, the inclusion of process edges in PCB production enhances the efficiency, reliability, and flexibility of the assembly process, ultimately leading to improved product quality.
1) The reserved process edge is designed to facilitate the attachment of additional parts to the PCB board, which can be removed after the manufacturing process. However, this can lead to increased consumption of boards and higher production costs. Therefore, it is important to consider both economy and manufacturability when designing PCB process edges. In some cases, the original PCB with 2 or 4 process edges can be simplified through PCB assembly.
2) When designing the splicing method for SMT chip mounting processing, it is essential to consider the track width of the SMT mounter. For splicing widths over 350mm, it is advisable to consult with the process engineer of the SMT supplier.
3) The flatness of the PCB production process edge is crucial. It is necessary to ensure that the process edge is flat, especially for PCBs with high assembly accuracy requirements, as any uneven burrs can result in the misalignment of installation hole positions, causing issues in subsequent PCB assembly.
4) PCB production process involves many complex steps, and operational errors can lead to quality problems in the final finished boards, affecting the product’s functionality. PCB disconnection is a common issue caused by various factors, including operational errors and process issues.
5) Common causes of PCB disconnection include problems in the film pasting, exposure, development, etching, and electroplating processes, as well as improper operation during production. It is important to carefully analyze the form of wire break and investigate the potential causes in the production process.
2. Components that are too close to the track edge may be absorbed by the SMT mounter nozzle and mounted on the circuit board, resulting in collision and production interruption.
3. In order to avoid this issue, process edges are generally added during PCB assembly production to accommodate subsequent patches and plug-ins.
4. What are the advantages of reserving process edges for PCB production?
5. By reserving process edges, PCB manufacturers can prevent potential collisions during the SMT mounting process, ensuring smooth production and high-quality assembly.
6. Additionally, the reserved process edges provide flexibility for future modifications or adjustments to the PCB layout, allowing for easier rework and troubleshooting.
7. Furthermore, the process edges can serve as a visual reference for PCB designers and as a protective buffer for delicate components, reducing the risk of damage during the assembly process.
8. Overall, the inclusion of process edges in PCB production enhances the efficiency, reliability, and flexibility of the assembly process, ultimately leading to improved product quality.
1) The reserved process edge is designed to facilitate the attachment of additional parts to the PCB board, which can be removed after the manufacturing process. However, this can lead to increased consumption of boards and higher production costs. Therefore, it is important to consider both economy and manufacturability when designing PCB process edges. In some cases, the original PCB with 2 or 4 process edges can be simplified through PCB assembly.
2) When designing the splicing method for SMT chip mounting processing, it is essential to consider the track width of the SMT mounter. For splicing widths over 350mm, it is advisable to consult with the process engineer of the SMT supplier.
3) The flatness of the PCB production process edge is crucial. It is necessary to ensure that the process edge is flat, especially for PCBs with high assembly accuracy requirements, as any uneven burrs can result in the misalignment of installation hole positions, causing issues in subsequent PCB assembly.
4) PCB production process involves many complex steps, and operational errors can lead to quality problems in the final finished boards, affecting the product’s functionality. PCB disconnection is a common issue caused by various factors, including operational errors and process issues.
5) Common causes of PCB disconnection include problems in the film pasting, exposure, development, etching, and electroplating processes, as well as improper operation during production. It is important to carefully analyze the form of wire break and investigate the potential causes in the production process.
