1）The machine moves too quickly during PCB transmission and positioning, leading to displacement of heavier components.

2）The SPI solder paste detector and AOI testing equipment failed to timely detect solder paste coating and placement issues.

1）The size of the pad does not correspond to the component pin size.

2）Rosin joint formation due to metallized holes on the pad.

1）Abnormal operation during PCB baking and transfer resulted in PCB deformation.

2）Improper operations during processing.