2. High-density arbitrary layer interconnection printed circuit board

For HDI with different hierarchical structures, there are significant differences in manufacturing processes. Generally, the more complex and multi-layered the structure, the more challenging it is to manufacture. Currently, several key technological characteristics describe the interconnections between board layers, including “step connection,” “wrong hole connection,” “cross-layer connection,” and “stacked hole connection,” which will not be elaborated on here. Ultra-high-density arbitrary-layer interconnected printed circuit boards represent the pinnacle of printed circuit board technology. Their primary demand stems from the electronic product market that necessitates lightweight, thin, and multifunctional features, such as smartphones, notebook computers, digital cameras, and LCD TVs.

3. Integrated printed circuit board

Integrated printed circuit board technology integrates one or more discrete electronic components (such as resistors, capacitors, etc.) into a printed circuit board structure, providing the integrated board with a certain level of system functionality. Integrated printed circuit boards enhance the reliability of electronic systems, improve signal transmission performance, effectively reduce production costs, and contribute to a greener, more environmentally friendly production process. This technology facilitates the miniaturization of electronic device system integration and has substantial market development potential. The system integration technology of embedding electronic components within printed boards is beginning to gain traction abroad, achieving breakthroughs in related materials and manufacturing processes. Industry-leading foreign companies are starting to mass-produce this technology.

4. High heat dissipation metal substrate

High heat dissipation metal substrates primarily leverage the superior thermal conductivity of the metal material to dissipate heat generated by high-power components. Their heat dissipation performance is closely related to the structural layout of multi-chip (component) packages and the reliability of these packages. As a high-end printed board, high heat dissipation metal substrates are compatible with surface mount technology, reducing product volume and hardware assembly costs, while replacing fragile ceramic substrates and enhancing rigidity for better mechanical durability. This makes them highly competitive among heat-dissipating substrates, with broad application prospects. Buried (embedded) metal-based printed circuit boards represent a novel heat dissipation PCB technology that has emerged in recent years. Its advanced heat dissipation design concept has not been extensively reported in domestic and international industry journals. As a heat dissipation substrate for high-power components, it offers several advantages due to its unique design:

(1) Excellent heat dissipation performance, as components are in direct contact with the heat sink, eliminating heat dissipation bottlenecks;

(2) Flexible design that fully meets the heat dissipation needs of individual high-power components;

(3) Embedded design that is coplanar with the PCB, maintaining compatibility with surface mount (SMD) technology;

(4) Lightweight and compact, aligning with the mainstream trend towards lighter, thinner, shorter, and smaller electronic assemblies;

(5) Compatibility with existing PCB production processes.

5. High frequency and high speed printed circuit board

High-frequency and high-speed printed circuits were utilized in the military sector as early as the late 20th century. In the past decade, some frequency bands originally reserved for military communications have been allocated for civilian use, enabling significant advancements in civil high-frequency and high-speed information transmission technologies. This has further propelled the evolution of electronic information technology across various industries, featuring capabilities such as long-distance communication, telemedicine surgery, and automated control and management of large logistics warehouses. It is important to note that the electronic components and printed circuit board industries involved in high-frequency signal transmission face strict technical requirements, including operating impedance range, metal connection smoothness, and specific requirements for line width and the relative distances between signal layers. Exceptional process technology has driven the industrial growth of electronic components and products, with demand expected to surge more than tenfold in the next five years.

6. Rigid-flex printed board technology

In recent years, the accelerated development of high-performance, multifunctional, and compact electronic devices has increased the demand for miniaturization and high density in electronic components and PCBs. To meet these demands, innovations in the manufacturing technology of laminated multilayer boards for rigid PCBs have led to the widespread adoption of various laminated multilayer boards in electronic devices. However, mobile devices, including portable gadgets and digital cameras, not only demand quicker cycles for introducing new functions or improving performance but also exhibit a strong preference for smaller, lighter designs. Consequently, the available space for functional components within the casing is limited, necessitating efficient utilization. In this context, a system structure composed of several small build-up multilayer boards and flexible boards (FPC) or connecting cables is commonly employed, known as analog rigid-flex PCB. Rigid-flex PCBs utilize this combination to save space, acting as a functional composite multi-layer board that integrates multiple rigid PCBs and FPCs. As they do not require connectors or additional connection space and offer comparable mountability to rigid PCBs, rigid-flex PCBs are becoming increasingly popular in mobile devices.

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