Welding is a crucial part of the design process for printed circuit boards, as it is used to secure electronic components onto the board. In PCBA processing, wave soldering and reflow soldering are two commonly used welding processes. However, the choice of welding method depends on the specific scenario. So, what exactly is the difference between these two welding processes?
DIP Wave Soldering: Wave soldering is a batch PCBA welding process that involves melting liquid tin at high temperatures to solder the PCB board components. The process includes flux spraying, pre-coating, wave soldering, and cooling. Flux is used to remove oxides from the board and provide smoother soldering. Preheating activates the flux, and wave soldering bonds the components to the board. The cooling process follows the temperature profile.
Reflow Soldering: Reflow soldering is used to permanently bond components that were temporarily adhered to pads on the board using solder paste. This process involves preheating, holding, reflow soldering, and cooling. Preheating removes volatile solvents, and holding ensures that all areas reach the necessary temperature. Reflow soldering melts the solder to form necessary joints, and proper cooling inhibits the formation of excess intermetallic compounds or thermal shock.
Difference between wave soldering and reflow soldering: In essence, wave soldering is primarily used for soldering plug-in components, while reflow soldering is mainly used for soldering SMD components. Therefore, when it comes to welding, it is important to consider the differences between wave soldering and reflow soldering.
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