1. **PCB Layout**

Based on a comprehensive consideration of signal quality, EMC, thermal design, DFM, DFT, structure, safety regulations, and other factors, the components are placed on the board in an optimal manner.

2. **General Principles of PCB Layout**

Unless specific requirements dictate otherwise, all component pad traces must adhere to thermal design guidelines.

3. It is clear that in PCB design, whether dealing with component placement or routing, engineers must consider and address the requirements of thermal design.

**What are the requirements for PCB thermal design?**

**The Importance of Thermal Design**

During operation, electronic equipment consumes electrical energy, such as in RF power amplifiers, FPGA chips, and power products. While some energy performs useful work, much of it is converted into heat, which must be dissipated. Excessive heat causes a rapid rise in internal temperature, and if not properly managed, this heat can lead to overheating, component failure, and a decrease in overall reliability. SMT (Surface-Mount Technology) further complicates heat dissipation by increasing component density and reducing the available surface area for heat dissipation. Consequently, thermal management is crucial for ensuring the reliability of electronic equipment.

**PCB Thermal Design Requirements**

1) When placing components, temperature-sensitive parts, except for temperature detection components, should be located near the air intake and upstream of high-power, high-heat components. They should be positioned as far as possible from heat-generating components to avoid thermal radiation. If significant separation is not possible, a heat shield (such as a thin, polished metal plate) can be used to block heat, with a preference for darker materials to improve shielding.

2) Heat-producing and heat-resistant components should be placed near the air outlet or on the top side of the PCB. However, if these components cannot tolerate higher temperatures, they should be positioned closer to the air intake. Additionally, efforts should be made to stagger their positions, avoiding direct alignment with other heat-sensitive or heat-generating components.

3) High-power components should be spread out across the PCB to avoid concentrating heat in one area. Components of varying sizes should be arranged to balance airflow and ensure even distribution of air volume, which helps in maintaining consistent cooling efficiency.

4) The vents should be positioned as closely as possible to devices that have high heat dissipation requirements.

5) Tall components should be placed behind shorter ones, with their long axis aligned in the direction that minimizes wind resistance, in order to prevent obstruction of the airflow.

**What are the requirements for PCB thermal design?**

6) The radiator arrangement should support effective airflow circulation within the cabinet. When relying on natural convection for heat dissipation, the fins should be oriented perpendicular to the ground. When using forced air for cooling, the fins should align with the direction of the airflow.

7) Multiple radiators should not be arranged too closely along the direction of airflow. The upstream radiator can disrupt the airflow, significantly reducing the wind speed over the downstream radiator. A staggered arrangement or increased spacing between the radiating fins is recommended.

8) An adequate gap should be maintained between the radiator and other components on the same PCB. It is advisable to perform thermal calculations to avoid undesirably raising the temperature of adjacent components.

9) To dissipate heat via the PCB, use techniques such as employing large copper areas (consider removing the solder mask) or using ground vias to channel heat to the PCB’s plane layers, allowing the entire board to assist in heat dissipation.
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