1. For the PCB board, SMT chip reflow soldering technology requires that the pads of two end Chip components should be independent pads.
2. When the bonding pad is connected with a large area of ground wire, cross paving method and 45 ° paving method shall be preferred.
3. The length of the lead wire from the large area ground wire or power line is more than 0.5mm and the width is less than 0.4mm.
4. The wire connected to the rectangular pad shall be led out from the center of the long side of the pad to avoid a certain angle.
What are the precautions for the direction and shape of the printed wire of PCB pad, and the direction and shape of the printed wire
1) The printed wire of the circuit board in the SMT should be short and simple, and easy to follow. It is important for quality control of PCB in the later stage.
2) The direction of the printed wire should not have sharp bends or acute angles, and the angle of the printed wire should not be less than 90°. Sharp inner corners are difficult to corrode during plate making, and outer corners that are too sharp can cause the copper foil to peel or warp. The turning form should be a gentle transition with rounded inside and outside corners.
3) When a wire passes between two pads but is not connected to them, it should be kept at an equal distance from them. Similarly, the distance between conductors should be uniform and maintained.
4) When connecting wires between PCB pads, if the center distance between pads is less than the outer diameter D of pads, the width of wires can be the same as the diameter of pads. If the center distance between pads is greater than D, the wire width should be reduced. If there are more than 3 pads on the pad, the distance between wires should be greater than 2D.
5) Copper foil should be reserved for common grounding wires as much as possible.
6) In order to increase the peeling strength of the pad, a non-conductive production line can be provided on the PCB board.
2. When the bonding pad is connected with a large area of ground wire, cross paving method and 45 ° paving method shall be preferred.
3. The length of the lead wire from the large area ground wire or power line is more than 0.5mm and the width is less than 0.4mm.
4. The wire connected to the rectangular pad shall be led out from the center of the long side of the pad to avoid a certain angle.
What are the precautions for the direction and shape of the printed wire of PCB pad, and the direction and shape of the printed wire
1) The printed wire of the circuit board in the SMT should be short and simple, and easy to follow. It is important for quality control of PCB in the later stage.
2) The direction of the printed wire should not have sharp bends or acute angles, and the angle of the printed wire should not be less than 90°. Sharp inner corners are difficult to corrode during plate making, and outer corners that are too sharp can cause the copper foil to peel or warp. The turning form should be a gentle transition with rounded inside and outside corners.
3) When a wire passes between two pads but is not connected to them, it should be kept at an equal distance from them. Similarly, the distance between conductors should be uniform and maintained.
4) When connecting wires between PCB pads, if the center distance between pads is less than the outer diameter D of pads, the width of wires can be the same as the diameter of pads. If the center distance between pads is greater than D, the wire width should be reduced. If there are more than 3 pads on the pad, the distance between wires should be greater than 2D.
5) Copper foil should be reserved for common grounding wires as much as possible.
6) In order to increase the peeling strength of the pad, a non-conductive production line can be provided on the PCB board.
