1. **Plate materials**: FR-4 and CEM-3 are common for double-sided and multi-layer PCBs. The price of these materials varies based on the board’s thickness and the thickness of the copper and dielectric layers. FR-1 and CEM-1 are typical for single-layer boards, and their prices differ significantly from those of double-sided and multi-layer boards.
2. **Board thickness**: Common thicknesses include 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.6mm, 2.0mm, 2.4mm, 3.0mm, and 3.4mm. The price difference among conventional thicknesses is generally minimal.
3. **Copper and dielectric layer thickness**: The thickness of copper and dielectric layers affects the price. Common copper thicknesses include 18µm (0.5oz), 35µm (1oz), 70µm (2oz), 105µm (3oz), and 140µm (4oz).
4. **Raw material suppliers**: Some of the most common suppliers are Shengyi, Jiantao, and International.
Process cost:
1. The cost varies depending on the circuit on the PCB. If the wire density is low (below 4/4mm), pricing will be calculated separately.
2. The presence of BGA on the board increases the cost. How much does BGA affect the price?
3. The cost also depends on the surface treatment process. Common treatments include: spray lead tin (hot air leveling), OSP (environmentally friendly board), spray pure tin, tin, silver, gold, etc. Prices vary with different surface technologies.
4. It depends on the process standard. Common standards include IPC2, but some customers, such as those from Japan, may require higher standards (e.g., IPC3, enterprise standard, military standard). Higher standards generally result in higher costs.
Every PCB in the industry is customized, so pricing requires a detailed cost calculation. This involves considering the automatic layout calculation of the PCB computer and the material utilization rate on standard-size copper clad laminate.
The cost calculation in the PCB industry is complex and unique. It involves step-by-step accounting of material, labor, and manufacturing costs from cutting, pressing, and forming to FQC, packaging, and storage. Costs are accumulated in batches based on the order product number. Different products, such as those with blind and buried vias or immersion gold boards, require special calculation methods due to process uniqueness. Drill nozzle size also impacts cost, affecting WIP and scrap cost evaluations.
PCB factories manufacture products for OEM customers, and customizations vary significantly, leading to few shared products. Quality considerations may lead customers to specify substrates or inks from particular manufacturers to meet quality and cost requirements.
Quick responses to changes are crucial for survival.
ECN (Engineering Change Notification) changes often occur in PCB production, involving both internal and external ECN (customer engineering file changes). Frequent ECN changes in product design can lead to significant scrap inventory if not managed properly. Effective planning for ECN changes in the ERP system is critical.
2. **Board thickness**: Common thicknesses include 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.6mm, 2.0mm, 2.4mm, 3.0mm, and 3.4mm. The price difference among conventional thicknesses is generally minimal.
3. **Copper and dielectric layer thickness**: The thickness of copper and dielectric layers affects the price. Common copper thicknesses include 18µm (0.5oz), 35µm (1oz), 70µm (2oz), 105µm (3oz), and 140µm (4oz).
4. **Raw material suppliers**: Some of the most common suppliers are Shengyi, Jiantao, and International.
Process cost:
1. The cost varies depending on the circuit on the PCB. If the wire density is low (below 4/4mm), pricing will be calculated separately.
2. The presence of BGA on the board increases the cost. How much does BGA affect the price?
3. The cost also depends on the surface treatment process. Common treatments include: spray lead tin (hot air leveling), OSP (environmentally friendly board), spray pure tin, tin, silver, gold, etc. Prices vary with different surface technologies.
4. It depends on the process standard. Common standards include IPC2, but some customers, such as those from Japan, may require higher standards (e.g., IPC3, enterprise standard, military standard). Higher standards generally result in higher costs.
Every PCB in the industry is customized, so pricing requires a detailed cost calculation. This involves considering the automatic layout calculation of the PCB computer and the material utilization rate on standard-size copper clad laminate.
The cost calculation in the PCB industry is complex and unique. It involves step-by-step accounting of material, labor, and manufacturing costs from cutting, pressing, and forming to FQC, packaging, and storage. Costs are accumulated in batches based on the order product number. Different products, such as those with blind and buried vias or immersion gold boards, require special calculation methods due to process uniqueness. Drill nozzle size also impacts cost, affecting WIP and scrap cost evaluations.
PCB factories manufacture products for OEM customers, and customizations vary significantly, leading to few shared products. Quality considerations may lead customers to specify substrates or inks from particular manufacturers to meet quality and cost requirements.
Quick responses to changes are crucial for survival.
ECN (Engineering Change Notification) changes often occur in PCB production, involving both internal and external ECN (customer engineering file changes). Frequent ECN changes in product design can lead to significant scrap inventory if not managed properly. Effective planning for ECN changes in the ERP system is critical.
