1. Solder Paste Printing Machine
Modern solder paste printers typically include plate loading, solder paste application, imprinting, and circuit board transfer. The operational principle involves first securing the circuit board on the printing positioning table, followed by the application of solder paste or adhesive onto the corresponding pads through the stencil using the printer’s left and right scrapers. The transfer station then feeds the board into the placement machine for automatic component placement.
2. Mounter
The mounting machine, also referred to as a “mounting machine” or “Surface Mount System,” is positioned in the production line after the solder paste printer. It accurately places surface-mounted components onto the PCB pads by moving the placement head. This equipment comes in both manual and automatic variants.
3. Reflow Soldering
Reflow soldering is a crucial process in electronics manufacturing, where solder paste is melted to create reliable electrical connections between components and the PCB. The process involves heating the assembly to a specific temperature profile to ensure proper melting and solidification of the solder.
1. Inside the reflow soldering process, a heating circuit heats air or nitrogen to a sufficiently high temperature, which is then blown onto the circuit board where components are attached. This causes the solder on both sides of the components to melt and bond to the motherboard. The advantages of this process include easy temperature control, prevention of oxidation during soldering, and better management of manufacturing costs.
2. AOI Detector
Automatic Optical Inspection (AOI) utilizes optical principles to detect common defects in soldering production. Though relatively new, AOI technology is rapidly advancing, and many manufacturers have begun to implement AOI testing equipment. During the automated inspection, the machine scans the PCB with a camera, captures images, and compares the solder joints against parameters stored in a database. After image processing, defects are identified and displayed or marked for maintenance personnel to address.
3. Component Trimming Machine
This machine is designed to cut and reshape pin components.
4. Wave Soldering
Wave soldering involves making the soldering surface of a plug-in board directly contact high-temperature liquid tin for soldering purposes. The liquid tin is maintained at an angle, with a special device creating a wave-like motion, hence the term “wave soldering.” The primary material used is solder bars.
5. Tin Furnace
Typically, a tin furnace is a welding tool utilized in electronic soldering. For discrete component circuit boards, it ensures good welding consistency, convenient operation, rapid processing, and high work efficiency, serving as an excellent aid for production.
6. Plate Washer
This device is used to clean PCBA boards, effectively removing residues left after soldering.
7. ICT Test Fixture
ICT testing primarily involves test probes contacting the test points of the PCB layout to detect open circuits, short circuits, and the soldering quality of all components on the PCBA.
8. FCT Test Fixture
Functional Testing (FCT) involves creating a simulated operating environment (stimulus and load) for the test target board (UUT: Unit Under Test), allowing it to operate in various design states. This process captures parameters from each state to evaluate the UUT’s functionality, essentially measuring whether the output response meets the required standards.
9. Aging Test Frame
The burn-in test rack can batch test PCBA boards, simulating long-term user operations to identify any potential issues.
Modern solder paste printers typically include plate loading, solder paste application, imprinting, and circuit board transfer. The operational principle involves first securing the circuit board on the printing positioning table, followed by the application of solder paste or adhesive onto the corresponding pads through the stencil using the printer’s left and right scrapers. The transfer station then feeds the board into the placement machine for automatic component placement.
2. Mounter
The mounting machine, also referred to as a “mounting machine” or “Surface Mount System,” is positioned in the production line after the solder paste printer. It accurately places surface-mounted components onto the PCB pads by moving the placement head. This equipment comes in both manual and automatic variants.
3. Reflow Soldering
Reflow soldering is a crucial process in electronics manufacturing, where solder paste is melted to create reliable electrical connections between components and the PCB. The process involves heating the assembly to a specific temperature profile to ensure proper melting and solidification of the solder.
1. Inside the reflow soldering process, a heating circuit heats air or nitrogen to a sufficiently high temperature, which is then blown onto the circuit board where components are attached. This causes the solder on both sides of the components to melt and bond to the motherboard. The advantages of this process include easy temperature control, prevention of oxidation during soldering, and better management of manufacturing costs.
2. AOI Detector
Automatic Optical Inspection (AOI) utilizes optical principles to detect common defects in soldering production. Though relatively new, AOI technology is rapidly advancing, and many manufacturers have begun to implement AOI testing equipment. During the automated inspection, the machine scans the PCB with a camera, captures images, and compares the solder joints against parameters stored in a database. After image processing, defects are identified and displayed or marked for maintenance personnel to address.
3. Component Trimming Machine
This machine is designed to cut and reshape pin components.
4. Wave Soldering
Wave soldering involves making the soldering surface of a plug-in board directly contact high-temperature liquid tin for soldering purposes. The liquid tin is maintained at an angle, with a special device creating a wave-like motion, hence the term “wave soldering.” The primary material used is solder bars.
5. Tin Furnace
Typically, a tin furnace is a welding tool utilized in electronic soldering. For discrete component circuit boards, it ensures good welding consistency, convenient operation, rapid processing, and high work efficiency, serving as an excellent aid for production.
6. Plate Washer
This device is used to clean PCBA boards, effectively removing residues left after soldering.
7. ICT Test Fixture
ICT testing primarily involves test probes contacting the test points of the PCB layout to detect open circuits, short circuits, and the soldering quality of all components on the PCBA.
8. FCT Test Fixture
Functional Testing (FCT) involves creating a simulated operating environment (stimulus and load) for the test target board (UUT: Unit Under Test), allowing it to operate in various design states. This process captures parameters from each state to evaluate the UUT’s functionality, essentially measuring whether the output response meets the required standards.
9. Aging Test Frame
The burn-in test rack can batch test PCBA boards, simulating long-term user operations to identify any potential issues.
