PCBA processing solder joints can be rendered invalid due to issues such as subpar electronic component pins, defects in flux quality, inadequate residues, and air oxidation. Furthermore, our quality control method involves submitting a manufacturability report (DFM) tailored to specific customer requirements. Now, let me delve into the details.
1. What causes solder joint invalidation in PCBA processing?
1. Improper positioning of electronic devices: factors include coating, environmental contamination, and air oxidation, among others.
2. Poor quality in the PCB welding layer: issues include coating, environmental contamination, air oxidation, and thermal expansion and contraction.
3. Shortcomings in welding material quality: factors such as composition, unqualified residues, and air oxidation are significant.
4. Limitations of flux quality: low-quality flux leads to high erosion rates and low SIR values.
6. Drawbacks of other auxiliary materials: concerns regarding adhesives and detergents.
Second, controlling the quality of PCBA processing:
1. Holding a pre-production meeting after receiving a PCBA processing order is crucial. This involves analyzing PCB Gerber files and submitting manufacturability reports (DFM) tailored to customer requirements. Many smaller manufacturers overlook this step, which often results in quality issues due to poor PCB design and increased rework and repairs.
2. Purchasing and inspecting electronic components for PCBA: Strict control over procurement channels is essential. Components should be sourced from reputable dealers and original manufacturers to prevent the use of second-hand or counterfeit materials. Additionally, establishing a dedicated incoming inspection station for PCBA is necessary to ensure components are free of defects.
PCB: Verify reflow oven temperature tests, check for blocked or leaking through holes, and inspect for board warping.
IC: Ensure that screen printing matches the specifications on the BOM, and store components under controlled temperature and humidity.
3. SMT assembly: Key focus areas include solder paste printing and reflow oven temperature control systems. High-quality laser templates are required, and adjustments to the steel mesh or U-shaped holes must align with PCB needs. Temperature control of the reflow oven is critical for solder paste wetting and mesh integrity, and adjustments should follow the standard SOP guidelines. Additionally, stringent implementation of AOI testing can significantly minimize human error defects.
4. Plug-in processing: The design of wave soldering molds is essential during the plug-in process. PE engineers should continually refine their methods to optimize mold usage and enhance productivity.
5. PCBA processing board testing: For orders with testing requirements, key tests include ICT (circuit test), FCT (functional test), burn-in testing (aging test), temperature and humidity testing, and drop testing.
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Let me know if you need further assistance!
1. What causes solder joint invalidation in PCBA processing?
1. Improper positioning of electronic devices: factors include coating, environmental contamination, and air oxidation, among others.
2. Poor quality in the PCB welding layer: issues include coating, environmental contamination, air oxidation, and thermal expansion and contraction.
3. Shortcomings in welding material quality: factors such as composition, unqualified residues, and air oxidation are significant.
4. Limitations of flux quality: low-quality flux leads to high erosion rates and low SIR values.
6. Drawbacks of other auxiliary materials: concerns regarding adhesives and detergents.
Second, controlling the quality of PCBA processing:
1. Holding a pre-production meeting after receiving a PCBA processing order is crucial. This involves analyzing PCB Gerber files and submitting manufacturability reports (DFM) tailored to customer requirements. Many smaller manufacturers overlook this step, which often results in quality issues due to poor PCB design and increased rework and repairs.
2. Purchasing and inspecting electronic components for PCBA: Strict control over procurement channels is essential. Components should be sourced from reputable dealers and original manufacturers to prevent the use of second-hand or counterfeit materials. Additionally, establishing a dedicated incoming inspection station for PCBA is necessary to ensure components are free of defects.
PCB: Verify reflow oven temperature tests, check for blocked or leaking through holes, and inspect for board warping.
IC: Ensure that screen printing matches the specifications on the BOM, and store components under controlled temperature and humidity.
3. SMT assembly: Key focus areas include solder paste printing and reflow oven temperature control systems. High-quality laser templates are required, and adjustments to the steel mesh or U-shaped holes must align with PCB needs. Temperature control of the reflow oven is critical for solder paste wetting and mesh integrity, and adjustments should follow the standard SOP guidelines. Additionally, stringent implementation of AOI testing can significantly minimize human error defects.
4. Plug-in processing: The design of wave soldering molds is essential during the plug-in process. PE engineers should continually refine their methods to optimize mold usage and enhance productivity.
5. PCBA processing board testing: For orders with testing requirements, key tests include ICT (circuit test), FCT (functional test), burn-in testing (aging test), temperature and humidity testing, and drop testing.
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Let me know if you need further assistance!
