Common Causes of Solder Joint Invalidation in PCBA Processing

Improper positioning of electronic devices: issues with coating, environmental contamination, and air oxidation can lead to solder joint problems.

Factors Affecting PCB Welding Layer Quality

Issues with coating, environmental contamination, air oxidation, and thermal expansion and contraction can impact the quality of the PCB welding layer.

Conducting a pre-production meeting to analyze PCB Gerber files and submit manufacturability reports tailored to customer requirements can help prevent quality issues.
Strict control over procurement channels for electronic components is crucial to avoid using substandard materials.
Ensuring proper SMT assembly with a focus on solder paste printing and reflow oven temperature control systems is essential for high-quality PCBA processing.
Optimizing wave soldering molds design during the plug-in process can enhance productivity.
Performing thorough board testing, including ICT, FCT, burn-in testing, temperature and humidity testing, and drop testing, is important for ensuring product quality.

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