For the PCB board technology article, the author can describe the challenges that PCB board design engineers have faced in recent times, as this has become an integral aspect of evaluating PCB board design. In the article, how to meet these challenges and potential solutions can be discussed; when solving PCB board design evaluation problems, the author can use Mentor’s PCB board evaluation software package as an example. As a research and development personnel, the consideration is how to integrate the advanced technology into the product. These advanced technologies can be reflected not only in excellent product functions but also in reducing product costs. The difficulty lies in how to effectively apply these technologies to products. There are many factors to consider, and time-to-market is one of the most important factors, and many decisions around time-to-market are constantly being updated. There is a wide range of factors to consider, ranging from product functionality, design implementation, product testing, and electromagnetic interference (EMI) compliance. It is possible to reduce design iterations, but it depends on the completion of the previous work. Most of the time, the easier it is to find problems later in the product design, and the more painful it is to make changes to the problems found. Here are a few factors that PCB board designers must consider and influence their decision:

1. Product Functionality

1.1 Essential functions cover essential requirements, including:

1) Interaction between schematic and PCB board layout

2) Routing functions such as automatic fan-out routing, push-pull, and routing capabilities based on design rule constraints

3) DRC checker

1.2 The ability to upgrade product functionality as the company engages in more complex designs, including:

1) HDI (High-Density Interconnect) interface

2) Flexible design

3) Embedding passive components

4) Radio Frequency (RF) Design

5) Automatic script generation

6) Topological layout and routing

7) Considerations for manufacturability (DFF), testability (DFT), manufacturability (DFM), etc.

2. Having a technically proficient partner who is a leader in the industry and has devoted more effort than other manufacturers can help design products with efficiency and technology within a short period of time.

3. Although price is a factor, it should be secondary to considerations such as ROI. Many factors need to be evaluated in PCB board selection. The type of development tools a designer requires depends on the complexity of their design work. As systems become more complex, control of physical routing and placement of electrical components becomes crucial. Designers must have a good understanding of their designs and associated rules to know when to apply them. Constraint rules for physical implementation should be consistent throughout the design process, reducing errors during the transition from file to layout. Designers are now revisiting their existing development tool capabilities and considering new ones:

3.1 HDI

With the increase in semiconductor complexity and the total number of logic gates, there is a need for integrated circuits with more pins and finer pin pitches. This has led to a demand for HDI technology, which includes features such as micro vias, ultra-thin dielectrics, thinner traces, and smaller line spacing.

3.2 RF Design

RF circuits should be integrated into the system schematic and board layout directly, rather than in a separate environment. Simulation, tuning, and optimization capabilities are still essential, but the design should accept raw data to minimize differences between data models and design transitions.

3.3 Advanced Packaging

The increasing functional complexity of products requires more passive components, leading to the need for high-density interconnect technology. Embedded passive components can be designed with high precision, enhancing circuit performance.

3.4 Rigid-flex PCB

Designers must consider all factors affecting the assembly process when designing a rigid-flex PCB board, including mechanical considerations such as bend radius, dielectric thickness and type, and overall circuit thickness.

3.5 Signal Integrity Planning

New technologies related to parallel and differential pair structures require designers to consider issues such as clock recovery at high frequencies, power supply noise, common-mode noise, and loss effects caused by IC packages, PCB boards, cables, and connectors.

3.6 Utility of Design Kits

Design kits for various technologies such as USB, DDR/DDR2, PCI-X, PCI-Express, and RocketIO can be valuable for designers entering new technologies, providing detailed descriptions, difficulties, simulations, and routing constraints to master advanced technologies. Selecting a PCB board tool that not only meets layout requirements but also addresses specific needs is essential.

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