1. Gold plating, also known as nickel plating gold, is a common type of surface treatment for PCBs. It involves depositing a layer of gold on the nickel barrier layer through electroplating during the manufacturing process.
2. There are two main types of gold plating: “hard gold plating” and “soft gold plating”.
3. Hard gold plating is characterized by a thicker gold layer, which provides better durability and wear resistance, making it suitable for components that require frequent insertion and removal.
4. Soft gold plating, on the other hand, has a thinner gold layer and is more suitable for applications where the contacts are not subjected to as much wear and tear.
5. The choice between hard and soft gold plating depends on the specific requirements of the PCB and its intended use.
6. Gold plating offers several benefits for PCBs, including excellent conductivity, corrosion resistance, and a reliable contact surface.
7. However, it is important to note that gold plating can add to the cost of PCB production, so it should be carefully considered based on the specific needs of the application.
Gold-plated PCB boards are created by applying a layer of gold on the surface of PCB circuit board pads through electroplating, utilizing hard gold. This process involves dissolving nickel and gold in a chemical solution, immersing the circuit board in an electroplating cylinder, and applying an electric current to generate a nickel-gold coating on the copper foil of the circuit board.
The Role of Gold Plating
1. Gold plating serves two functions: wear resistance and corrosion resistance. Parts with sockets and gold fingers, as well as areas in contact with conductive rubber, require gold plating. Gold-plated circuit boards are necessary for circuits operating in highly corrosive environments to prevent oxidation and protect the underlying nickel and copper layers. The wear-resistant gold plating provides good reliability.
2. The advantages of gold-plated PCB boards include strong conductivity, excellent oxidation resistance, and a long service life. The dense and relatively wear-resistant coating is commonly used in welding and socket applications. The gold plating process is widely used in circuit board components such as solder pads, gold fingers, and connector shrapnel. Most hand circuit boards utilize gold-plated boards.
3. Gold plating offers low contact resistance, good conductivity, easy welding, strong corrosion resistance, and certain wear resistance (hard gold), making it widely used in precision instruments, printed circuit boards, integrated circuits, tube shells, electrical contacts, and other fields.
The Difference between Soft Gold and Hard Gold
In PCB gold plating, hard gold plating is an electroplating alloy that has been alloyed with other elements to make it harder, whereas soft gold plating is pure gold. Hard gold plating is suitable for areas requiring friction, such as gold fingers and keyboards, while soft gold is commonly used for aluminum or gold wiring on COB (on-board chips).
The Difference between PCB Gold Deposition and Plating
1. Process principle: PCB gold deposition deposits metal ions on the circuit board surface by immersing the board in a solution containing gold salts and reducing agents, while gold plating deposits gold ions on the surface of the circuit board through electroplating.
2. Metal thickness: PCB gold deposition forms a relatively thick metal layer, typically reaching 2-5 microns, while gold plating creates a thinner layer, usually around 0.5-1.5 microns.
3. Metal color: The metal color of heavy gold is golden yellow, while the metal color of gold plating is light yellow.
4. Surface flatness: The surface of heavy gold is relatively flat, maintaining high-quality welding and contact performance, while the surface of gold plating is rougher and prone to welding and contact issues.
5. Cost: The cost of heavy gold is relatively high due to requiring more chemical reagents and a longer processing time, whereas gold plating is relatively low in cost due to its shorter processing time and simpler operation.
Process Flow of PCB Gold Plating
1. Surface treatment: Clean the PCB surface to remove oil stains, burrs, and oxide layers.
2. Electroplating: Place the PCB in an electroplating bath with the plating solution containing a reducing agent to deposit gold atoms onto the surface.
3. Water washing: Clean the metal deposition from the PCB surface with water.
4. Drying: Dry the PCB in a drying oven.
5. Adhesive application: Apply a conductive adhesive to ensure good contact between the PCB and other devices.
6. Recycling: Remove the PCB from the adhesive tape and place it in the recycling bin.
Gold-plated PCB boards offer protective benefits by shielding the circuit board from oxidation, corrosion, and other environmental effects, ultimately increasing the circuit board’s service life. The inherent conductivity of metals also enhances the conductivity of PCBs and reduces line impedance.
2. There are two main types of gold plating: “hard gold plating” and “soft gold plating”.
3. Hard gold plating is characterized by a thicker gold layer, which provides better durability and wear resistance, making it suitable for components that require frequent insertion and removal.
4. Soft gold plating, on the other hand, has a thinner gold layer and is more suitable for applications where the contacts are not subjected to as much wear and tear.
5. The choice between hard and soft gold plating depends on the specific requirements of the PCB and its intended use.
6. Gold plating offers several benefits for PCBs, including excellent conductivity, corrosion resistance, and a reliable contact surface.
7. However, it is important to note that gold plating can add to the cost of PCB production, so it should be carefully considered based on the specific needs of the application.
Gold-plated PCB boards are created by applying a layer of gold on the surface of PCB circuit board pads through electroplating, utilizing hard gold. This process involves dissolving nickel and gold in a chemical solution, immersing the circuit board in an electroplating cylinder, and applying an electric current to generate a nickel-gold coating on the copper foil of the circuit board.
The Role of Gold Plating
1. Gold plating serves two functions: wear resistance and corrosion resistance. Parts with sockets and gold fingers, as well as areas in contact with conductive rubber, require gold plating. Gold-plated circuit boards are necessary for circuits operating in highly corrosive environments to prevent oxidation and protect the underlying nickel and copper layers. The wear-resistant gold plating provides good reliability.
2. The advantages of gold-plated PCB boards include strong conductivity, excellent oxidation resistance, and a long service life. The dense and relatively wear-resistant coating is commonly used in welding and socket applications. The gold plating process is widely used in circuit board components such as solder pads, gold fingers, and connector shrapnel. Most hand circuit boards utilize gold-plated boards.
3. Gold plating offers low contact resistance, good conductivity, easy welding, strong corrosion resistance, and certain wear resistance (hard gold), making it widely used in precision instruments, printed circuit boards, integrated circuits, tube shells, electrical contacts, and other fields.
The Difference between Soft Gold and Hard Gold
In PCB gold plating, hard gold plating is an electroplating alloy that has been alloyed with other elements to make it harder, whereas soft gold plating is pure gold. Hard gold plating is suitable for areas requiring friction, such as gold fingers and keyboards, while soft gold is commonly used for aluminum or gold wiring on COB (on-board chips).
The Difference between PCB Gold Deposition and Plating
1. Process principle: PCB gold deposition deposits metal ions on the circuit board surface by immersing the board in a solution containing gold salts and reducing agents, while gold plating deposits gold ions on the surface of the circuit board through electroplating.
2. Metal thickness: PCB gold deposition forms a relatively thick metal layer, typically reaching 2-5 microns, while gold plating creates a thinner layer, usually around 0.5-1.5 microns.
3. Metal color: The metal color of heavy gold is golden yellow, while the metal color of gold plating is light yellow.
4. Surface flatness: The surface of heavy gold is relatively flat, maintaining high-quality welding and contact performance, while the surface of gold plating is rougher and prone to welding and contact issues.
5. Cost: The cost of heavy gold is relatively high due to requiring more chemical reagents and a longer processing time, whereas gold plating is relatively low in cost due to its shorter processing time and simpler operation.
Process Flow of PCB Gold Plating
1. Surface treatment: Clean the PCB surface to remove oil stains, burrs, and oxide layers.
2. Electroplating: Place the PCB in an electroplating bath with the plating solution containing a reducing agent to deposit gold atoms onto the surface.
3. Water washing: Clean the metal deposition from the PCB surface with water.
4. Drying: Dry the PCB in a drying oven.
5. Adhesive application: Apply a conductive adhesive to ensure good contact between the PCB and other devices.
6. Recycling: Remove the PCB from the adhesive tape and place it in the recycling bin.
Gold-plated PCB boards offer protective benefits by shielding the circuit board from oxidation, corrosion, and other environmental effects, ultimately increasing the circuit board’s service life. The inherent conductivity of metals also enhances the conductivity of PCBs and reduces line impedance.
