1. FPC (Flexible Printed Circuit) is a type of PCB, often referred to as a “soft board.”
2. FPC is constructed from flexible substrates, such as polyimide or polyester films.
3. It offers several advantages, including high wiring density, lightweight design, thin profile, and significant flexibility.
4. It can endure millions of dynamic bends without causing damage to the circuits.
5. Based on spatial layout requirements, FPC can be manipulated and expanded freely, enabling three-dimensional assembly.
6. This results in an effective integration of component assembly and wire connections, providing benefits that other types of circuit boards cannot offer.
7. Multilayer FPC
8. Multilayer FPC circuit board
1. **Application**
Mobile Phone
Emphasizing the lightweight and slim design of flexible circuit boards, they effectively reduce product volume and facilitate the seamless connection of components like the battery, microphone, and buttons.
2. **Computer and LCD Screen**
By leveraging the integrated circuit design and thin profile of flexible circuit boards, digital signals are transformed into images displayed on LCD screens.
3. **CD Walkman**
Highlighting the three-dimensional assembly capabilities and slimness of flexible circuit boards, they enable large CDs to become convenient, portable companions.
4. **Disk Drive**
Whether for hard disks or floppy disks, the high flexibility and ultra-thin 0.1mm thickness of FPCs are crucial for rapid data reading, applicable to both PCs and notebooks.
5. **Latest Use**
Components like the suspension circuit (Suinensi circuit) and the xe package board for hard disk drives (HDD) are now being utilized.
6. **Future Development**
Given the expansive FPC market in China, major firms from Japan, the U.S., and Taiwan have established factories there. By 2012, flexible circuit boards had experienced significant growth, akin to rigid circuit boards. However, following the product lifecycle of “introduction-development-climax-decline-elimination,” FPCs currently sit between climax and decline. To maintain market share and innovate, FPCs must evolve to escape this cycle.
7. **Innovation Focus**
Future innovations in FPCs will primarily target four areas:
1. **Thickness**: FPCs must become even more flexible and thinner.
2. **Folding Resistance**: The inherent flexibility must increase, achieving fold resistance exceeding 10,000 cycles, necessitating improved substrates.
3. **Price**: Currently, FPCs are significantly more expensive than PCBs; lowering prices could broaden market reach.
4. **Technological Level**: To meet diverse demands, FPC processes must advance, achieving tighter specifications for minimum aperture, line width, and spacing.
By innovating in these four areas, FPCs can enter a promising new phase!
2. FPC is constructed from flexible substrates, such as polyimide or polyester films.
3. It offers several advantages, including high wiring density, lightweight design, thin profile, and significant flexibility.
4. It can endure millions of dynamic bends without causing damage to the circuits.
5. Based on spatial layout requirements, FPC can be manipulated and expanded freely, enabling three-dimensional assembly.
6. This results in an effective integration of component assembly and wire connections, providing benefits that other types of circuit boards cannot offer.
7. Multilayer FPC
8. Multilayer FPC circuit board
1. **Application**
Mobile Phone
Emphasizing the lightweight and slim design of flexible circuit boards, they effectively reduce product volume and facilitate the seamless connection of components like the battery, microphone, and buttons.
2. **Computer and LCD Screen**
By leveraging the integrated circuit design and thin profile of flexible circuit boards, digital signals are transformed into images displayed on LCD screens.
3. **CD Walkman**
Highlighting the three-dimensional assembly capabilities and slimness of flexible circuit boards, they enable large CDs to become convenient, portable companions.
4. **Disk Drive**
Whether for hard disks or floppy disks, the high flexibility and ultra-thin 0.1mm thickness of FPCs are crucial for rapid data reading, applicable to both PCs and notebooks.
5. **Latest Use**
Components like the suspension circuit (Suinensi circuit) and the xe package board for hard disk drives (HDD) are now being utilized.
6. **Future Development**
Given the expansive FPC market in China, major firms from Japan, the U.S., and Taiwan have established factories there. By 2012, flexible circuit boards had experienced significant growth, akin to rigid circuit boards. However, following the product lifecycle of “introduction-development-climax-decline-elimination,” FPCs currently sit between climax and decline. To maintain market share and innovate, FPCs must evolve to escape this cycle.
7. **Innovation Focus**
Future innovations in FPCs will primarily target four areas:
1. **Thickness**: FPCs must become even more flexible and thinner.
2. **Folding Resistance**: The inherent flexibility must increase, achieving fold resistance exceeding 10,000 cycles, necessitating improved substrates.
3. **Price**: Currently, FPCs are significantly more expensive than PCBs; lowering prices could broaden market reach.
4. **Technological Level**: To meet diverse demands, FPC processes must advance, achieving tighter specifications for minimum aperture, line width, and spacing.
By innovating in these four areas, FPCs can enter a promising new phase!
