PCB Design Self-Inspection Process

1. Structural Design

• Verify the PCB floor plan and structure diagram.
• Check mounting hole locations and diameters.
• Inspect wiring constraint areas.

2. Component Library

• Confirm component sizes and pin counts.
• Ensure BGA device’s silk screen frame matches DATA SHEET specifications.
• Check component labeling and positioning.
• Verify component positioning holes.

3. Component Layout

• Avoid component overlap.
• Maintain a minimum spacing of 8 mils between components.
• Ensure compliance with no-go zones.
• Place decoupling capacitors near relevant components.

4. PCB Routing

• Comply with no-go area requirements.
• Route adjacent layers perpendicularly.
• Inspect critical signal traces individually.
• Check differential signal trace routing.

5. Solder Mask

• Ensure proper solder mask window sizes.
• Maintain solder mask bridge width.
• Openings for solder mask and paste layer on specific components.

6. Silkscreen Layer

• Avoid silkscreen overlap with pads.
• Properly align silkscreen text.
• Ensure clear and readable silkscreen characters.

7. Vias

• Inspect through-holes for components.
• Consider via capacity for power traces.
• Prevent solder bridging with proper via and pad placement.

8. Gerber Files

• Review Gerber files layer by layer.
• Stack and verify Gerber files.
• Check green oil bridge width in Gerber files.

9. PCB Output File Checks

• Verify PCB schematic diagram and Gerber files.
• Conduct Design Rule Check (DRC).
• Review drilling files and assembly drawings.

The self-inspection process for PCB design involves thorough checks to ensure design accuracy and compliance with standards. For detailed reviews and submissions, it is recommended to assign a dedicated staff member.

If you have any questions regarding PCB design, feel free to contact info@wellcircuits.com.