1. Early flexible circuit boards (hereinafter referred to as soft boards) primarily find applications in small or thin electronic mechanisms and in connecting rigid boards.
2. By the late 1970s, they were increasingly adopted in electronic information products such as computers, cameras, printers, car stereos, and hard disk drives.
3. Currently, the Japanese FPC market is still largely focused on consumer electronics, while the US has gradually transitioned from military applications to consumer use for everyday needs.
4. The functions of soft boards can be categorized into four types: Lead Line, Printed Circuit, Connector, and Functional Integration.
5. Their usage spans computers and peripherals, consumer household appliances, and automotive systems.
6. COPPER Clad Laminator (CCL)
7. CU (Copper foil): E.D. and R.A. copper foil
8. The copper layer is classified into RA (Rolled Annealed) and ED (Electrodeposited) copper.
9. These types have distinct characteristics owing to their manufacturing processes: ED copper is less expensive but fragile, while RA copper, though costlier, offers superior flexibility.
10. Thus, FPC copper foil is predominantly made from RA copper.
11. A (Adhesive): Acrylic and epoxy resin thermosetting adhesive
12. Adhesives fall into two main categories: Acrylic and Modified Epoxy.
13. PI (Kapton): Polyimide (polyimide film)
14. “PI” stands for Polyimide, a term used by DuPont for its product Kapton, measured in mils (1/1000 inch).
15. Its characteristics include thinness, high-temperature resistance, strong chemical resistance, and excellent electrical insulation.
16. Currently, the FPC insulation layer meets specific soldering requirements with Kapton.
17. Features:
18. It offers a high degree of flexibility, enabling three-dimensional wiring and adaptability to spatial constraints.
19. It exhibits resistance to extreme temperatures and flames.
20. It can be folded without compromising signal transmission and prevents electrostatic interference.
21. It maintains stable chemical properties, ensuring high reliability and stability.
22. This is advantageous for product design, reducing assembly time and errors while extending product lifespan.
23. The size of the application products decreases significantly, resulting in reduced weight, enhanced functionality, and lower costs.
24. Polyimide Resin
25. Polyimide resin is a general term for heat-resistant resins typified by polypyromellitic acid imide, produced from an oxygen-containing base and anhydrous pyromellitic acid, featuring five imine rings.
1. Polyimide resin is the most versatile among all high heat-resistant polymers. It can produce various sensors, such as polypyromellitic acid imide, and other types of sensors, allowing for multifunctionality and widespread use. Although the application of polypyromellitic acid imide is significantly limited due to its inability to melt, it has been successfully developed by slightly sacrificing its heat resistance to create a polyamide that can either melt or dissolve in a solvent. After the introduction of amines, its usage rapidly expanded.
2. When considering polyimide resin for PCB printed circuit boards, it is essential to focus on heat resistance, formability, mechanical properties, dimensional stability, electrical properties, and cost. As a result, there are numerous restrictions on its application. Consequently, only a limited number of addition polymerization thermosetting polyimides are currently utilized for multilayer printed circuit boards exceeding ten layers.
3. However, it is anticipated that usage will continue to rise in the future, as indicated in the table below. Additionally, the bottom protective film of the flexible circuit board is still the polypyromellitic acid imide currently in use.
4. The conductors in printed circuit boards consist of thin, foil-like copper, commonly referred to as copper foil. Based on their manufacturing methods, they can be classified as either electrolytic copper foil or rolled copper foil.
5. **Function Purpose**
Leading Circuit: Connects rigid PCBs, 3D circuits, movable circuits, and high-density circuits in commercial electronic equipment, car dashboards, printers, hard disk drives, floppy disk drives, fax machines, car mobile phones, general phones, and notebook computers.
Printed Circuit: High-density thin 3D circuits used in cameras, camcorders, CD-ROMs, hard disks, watches, etc.
Connector: Provides low-cost connections between hard boards for various electronic products.
Multifunctional Integration: Combines hard board lead wires and connectors in systems for computers, cameras, and medical equipment.
2. By the late 1970s, they were increasingly adopted in electronic information products such as computers, cameras, printers, car stereos, and hard disk drives.
3. Currently, the Japanese FPC market is still largely focused on consumer electronics, while the US has gradually transitioned from military applications to consumer use for everyday needs.
4. The functions of soft boards can be categorized into four types: Lead Line, Printed Circuit, Connector, and Functional Integration.
5. Their usage spans computers and peripherals, consumer household appliances, and automotive systems.
6. COPPER Clad Laminator (CCL)
7. CU (Copper foil): E.D. and R.A. copper foil
8. The copper layer is classified into RA (Rolled Annealed) and ED (Electrodeposited) copper.
9. These types have distinct characteristics owing to their manufacturing processes: ED copper is less expensive but fragile, while RA copper, though costlier, offers superior flexibility.
10. Thus, FPC copper foil is predominantly made from RA copper.
11. A (Adhesive): Acrylic and epoxy resin thermosetting adhesive
12. Adhesives fall into two main categories: Acrylic and Modified Epoxy.
13. PI (Kapton): Polyimide (polyimide film)
14. “PI” stands for Polyimide, a term used by DuPont for its product Kapton, measured in mils (1/1000 inch).
15. Its characteristics include thinness, high-temperature resistance, strong chemical resistance, and excellent electrical insulation.
16. Currently, the FPC insulation layer meets specific soldering requirements with Kapton.
17. Features:
18. It offers a high degree of flexibility, enabling three-dimensional wiring and adaptability to spatial constraints.
19. It exhibits resistance to extreme temperatures and flames.
20. It can be folded without compromising signal transmission and prevents electrostatic interference.
21. It maintains stable chemical properties, ensuring high reliability and stability.
22. This is advantageous for product design, reducing assembly time and errors while extending product lifespan.
23. The size of the application products decreases significantly, resulting in reduced weight, enhanced functionality, and lower costs.
24. Polyimide Resin
25. Polyimide resin is a general term for heat-resistant resins typified by polypyromellitic acid imide, produced from an oxygen-containing base and anhydrous pyromellitic acid, featuring five imine rings.
1. Polyimide resin is the most versatile among all high heat-resistant polymers. It can produce various sensors, such as polypyromellitic acid imide, and other types of sensors, allowing for multifunctionality and widespread use. Although the application of polypyromellitic acid imide is significantly limited due to its inability to melt, it has been successfully developed by slightly sacrificing its heat resistance to create a polyamide that can either melt or dissolve in a solvent. After the introduction of amines, its usage rapidly expanded.
2. When considering polyimide resin for PCB printed circuit boards, it is essential to focus on heat resistance, formability, mechanical properties, dimensional stability, electrical properties, and cost. As a result, there are numerous restrictions on its application. Consequently, only a limited number of addition polymerization thermosetting polyimides are currently utilized for multilayer printed circuit boards exceeding ten layers.
3. However, it is anticipated that usage will continue to rise in the future, as indicated in the table below. Additionally, the bottom protective film of the flexible circuit board is still the polypyromellitic acid imide currently in use.
4. The conductors in printed circuit boards consist of thin, foil-like copper, commonly referred to as copper foil. Based on their manufacturing methods, they can be classified as either electrolytic copper foil or rolled copper foil.
5. **Function Purpose**
Leading Circuit: Connects rigid PCBs, 3D circuits, movable circuits, and high-density circuits in commercial electronic equipment, car dashboards, printers, hard disk drives, floppy disk drives, fax machines, car mobile phones, general phones, and notebook computers.
Printed Circuit: High-density thin 3D circuits used in cameras, camcorders, CD-ROMs, hard disks, watches, etc.
Connector: Provides low-cost connections between hard boards for various electronic products.
Multifunctional Integration: Combines hard board lead wires and connectors in systems for computers, cameras, and medical equipment.
