What are the methods for processing PCB shapes?
PCB blanking, as well as hole and shape processing, can all utilize die punching techniques. For simple PCBs or those with less stringent requirements, the punching method is appropriate. This approach is ideal for producing low-complexity, high-volume PCBs with minimal specifications, and it offers cost advantages.
Punching: For single-sided paper substrates and double-sided non-metalized epoxy glass cloth substrates produced in large quantities, especially when there are various types and numerous holes with complex shapes, one or more molds are typically employed for punching.
Shape processing: In the production of large batches of single-sided and double-sided PCBs, die punching is generally the method of choice. Depending on the PCB dimensions, it can be categorized into upper blanking dies and falling material dies.
Composite processing: When precision is essential for both PCB holes and shapes, and to minimize manufacturing time while enhancing productivity, a composite mold is used to simultaneously process the holes and shapes of the single panel.
The key to processing PCBs with molds lies in the design and fabrication of these molds, necessitating specialized technical expertise. Additionally, mold installation and adjustment are critical factors. Currently, the majority of molds used in PCB manufacturing are produced by external suppliers.
**Precautions for Mold Installation:**
1. Choose the punch (including type and tonnage) based on the punching force calculated during mold design, as well as the mold dimensions and closing height.
2. Start the punch and verify that the clutch, brake, slider, and other components are functioning correctly. Ensure that the operating mechanism is reliable and that there are no issues with continuous punching.
3. The shim under the die typically consists of two pieces, which should be ground simultaneously on a grinder to guarantee that the die is installed both parallel and vertical. The shim’s leap position must not interfere with the blanking process and should ideally be as close to the mold’s center as possible.
4. Prepare several sets of pressure plates and T-head pressure plate screws for use with the mold. The front end of the pressure plate must not contact the straight wall of the lower mold. Place emery cloth between the contact surfaces, ensuring that the screws are tightened securely.
5. During mold installation, take special care to avoid contact between the screws and nuts on the lower mold and the upper mold when it is lowered.
6. When adjusting the mold, prioritize manual methods over automated maneuvers whenever possible.
7. To enhance the punching performance of the substrate, preheat the paper substrate to a temperature of approximately 70-90°C.
The PCB holes and shapes are punched using the die, and the potential quality defects include:
– Protrusions around the hole, warping, or delamination of the copper foil
– Cracks between holes
– Misalignment of hole positions, or holes that are not vertical
– Excessive burrs
– Rough edges on sections
– PCB warping resembling a pot shape
– Waste blockage
**Inspection and Analysis Steps:**
1. Assess whether the punching force and rigidity of the punch are adequate.
2. Evaluate the reasonableness of the mold design and confirm its rigidity.
3. Check the processing accuracy of the convex and concave molds, guide posts, and guide sleeves, ensuring installation is both concentric and vertical, with uniform fit clearance. An improper gap between the convex and concave can lead to quality defects; this is a critical consideration in mold design, fabrication, adjustment, and use.
4. Edges of the convex and concave molds should not be rounded or chamfered. The punch must not exhibit taper, particularly during punching, whether in the form of a positive or inverted cone.
5. During production, monitor the wear on the cutting edges of both convex and concave molds.
6. Evaluate whether the discharge port is designed appropriately and offers minimal resistance.
7. Ensure that the pushing plate and punching rod are suitably designed and provide sufficient force.
8. Consider factors such as the thickness of the sheet being punched, the adhesive strength of the substrate, the amount of adhesive, the bonding force with the copper foil, as well as preheating humidity and duration when analyzing punching quality defects.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me
PCB blanking, as well as hole and shape processing, can all utilize die punching techniques. For simple PCBs or those with less stringent requirements, the punching method is appropriate. This approach is ideal for producing low-complexity, high-volume PCBs with minimal specifications, and it offers cost advantages.
Punching: For single-sided paper substrates and double-sided non-metalized epoxy glass cloth substrates produced in large quantities, especially when there are various types and numerous holes with complex shapes, one or more molds are typically employed for punching.
Shape processing: In the production of large batches of single-sided and double-sided PCBs, die punching is generally the method of choice. Depending on the PCB dimensions, it can be categorized into upper blanking dies and falling material dies.
Composite processing: When precision is essential for both PCB holes and shapes, and to minimize manufacturing time while enhancing productivity, a composite mold is used to simultaneously process the holes and shapes of the single panel.
The key to processing PCBs with molds lies in the design and fabrication of these molds, necessitating specialized technical expertise. Additionally, mold installation and adjustment are critical factors. Currently, the majority of molds used in PCB manufacturing are produced by external suppliers.
**Precautions for Mold Installation:**
1. Choose the punch (including type and tonnage) based on the punching force calculated during mold design, as well as the mold dimensions and closing height.
2. Start the punch and verify that the clutch, brake, slider, and other components are functioning correctly. Ensure that the operating mechanism is reliable and that there are no issues with continuous punching.
3. The shim under the die typically consists of two pieces, which should be ground simultaneously on a grinder to guarantee that the die is installed both parallel and vertical. The shim’s leap position must not interfere with the blanking process and should ideally be as close to the mold’s center as possible.
4. Prepare several sets of pressure plates and T-head pressure plate screws for use with the mold. The front end of the pressure plate must not contact the straight wall of the lower mold. Place emery cloth between the contact surfaces, ensuring that the screws are tightened securely.
5. During mold installation, take special care to avoid contact between the screws and nuts on the lower mold and the upper mold when it is lowered.
6. When adjusting the mold, prioritize manual methods over automated maneuvers whenever possible.
7. To enhance the punching performance of the substrate, preheat the paper substrate to a temperature of approximately 70-90°C.
The PCB holes and shapes are punched using the die, and the potential quality defects include:
– Protrusions around the hole, warping, or delamination of the copper foil
– Cracks between holes
– Misalignment of hole positions, or holes that are not vertical
– Excessive burrs
– Rough edges on sections
– PCB warping resembling a pot shape
– Waste blockage
**Inspection and Analysis Steps:**
1. Assess whether the punching force and rigidity of the punch are adequate.
2. Evaluate the reasonableness of the mold design and confirm its rigidity.
3. Check the processing accuracy of the convex and concave molds, guide posts, and guide sleeves, ensuring installation is both concentric and vertical, with uniform fit clearance. An improper gap between the convex and concave can lead to quality defects; this is a critical consideration in mold design, fabrication, adjustment, and use.
4. Edges of the convex and concave molds should not be rounded or chamfered. The punch must not exhibit taper, particularly during punching, whether in the form of a positive or inverted cone.
5. During production, monitor the wear on the cutting edges of both convex and concave molds.
6. Evaluate whether the discharge port is designed appropriately and offers minimal resistance.
7. Ensure that the pushing plate and punching rod are suitably designed and provide sufficient force.
8. Consider factors such as the thickness of the sheet being punched, the adhesive strength of the substrate, the amount of adhesive, the bonding force with the copper foil, as well as preheating humidity and duration when analyzing punching quality defects.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me
